Packaging arrangement for power semiconductor devices
First Claim
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1. A packaging arrangement for power semiconductor devices, comprising:
- a unitary case having two sides, each of said sides having two opposite surfaces;
one of the two opposite surfaces of each of the two sides having a wall secured thereto and extending continuously and peripherally therearound, said wall defining a heat sink on said one surface;
the other of the opposite surfaces of each of the two sides including longitudinally extending integral cooling fins;
at least two slots extending transversely across the longitudinally extending integral cooling fins on the other of the opposite surfaces of each of the two sides for providing cooling fluid turbulence;
the two sides arranged so that the integral cooling fins on the other of the opposite surfaces of each of the two sides cooperate to provide an integral fin arrangement;
each of the heat sinks on the one of the two opposite surfaces of each of the two sides having mounted thereto a plurality of substrates with a conductor mounted to each of the substrates;
power semiconductor devices disposed on the conductors so as to be conductively interconnected through said conductors;
each of the two sides of the case closed by a lid for hermetically sealing the case; and
a side of one of the walls on the one of the two opposite surfaces of one of the two sides having feedthrough holes for accepting feedthroughs connected to said power semiconductor devices.
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Abstract
A two-sided hermetically sealed package of a metal matrix composite material includes a heat sink and integral cooling fins on each of the two sides which are totally enclosed to retain cooling fluid. Power semiconductors are mounted on ceramic substrates having metallic conductors mounted on both sides thereof. The substrates are mounted to the heat sinks. Cooling is provided by the passage of cooling fluid into one end of the enclosed fins, over the fins and out the other end. The metal matrix composite material and the ceramic are thermally matched and the package is provided with a minimum number of thermal interfaces.
13 Citations
13 Claims
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1. A packaging arrangement for power semiconductor devices, comprising:
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a unitary case having two sides, each of said sides having two opposite surfaces; one of the two opposite surfaces of each of the two sides having a wall secured thereto and extending continuously and peripherally therearound, said wall defining a heat sink on said one surface; the other of the opposite surfaces of each of the two sides including longitudinally extending integral cooling fins; at least two slots extending transversely across the longitudinally extending integral cooling fins on the other of the opposite surfaces of each of the two sides for providing cooling fluid turbulence; the two sides arranged so that the integral cooling fins on the other of the opposite surfaces of each of the two sides cooperate to provide an integral fin arrangement; each of the heat sinks on the one of the two opposite surfaces of each of the two sides having mounted thereto a plurality of substrates with a conductor mounted to each of the substrates; power semiconductor devices disposed on the conductors so as to be conductively interconnected through said conductors; each of the two sides of the case closed by a lid for hermetically sealing the case; and a side of one of the walls on the one of the two opposite surfaces of one of the two sides having feedthrough holes for accepting feedthroughs connected to said power semiconductor devices. - View Dependent Claims (2, 3, 4, 5)
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6. A method for packaging power semiconductor devices, comprising:
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forming two sides of a unitary case so that each of said sides has two opposite surfaces; forming one of said opposite surfaces of each of the two case sides with longitudinally extending integral cooling fins; forming the longitudinally extending cooling fins with at least two transversely extending slots for providing cooling fluid turbulence; securing a wall to the other of the two opposite surfaces of each of the two sides, said walls extending continuously and peripherally around said opposite surfaces so as to define a heat sink on each of said two sides; mounting a plurality of substrates having conductors mounted thereto on the heat sink on each of the two sides; disposing power semiconductor devices on the conductors for conductively interconnecting said semiconductor devices; providing feedthrough holes in a side of one of the walls on the one of the two opposite surfaces of one of the two sides; inserting feedthroughs in said holes and connecting the feedthroughs to the power semiconductor devices; joining the two sides of the case at the one of their opposite surfaces for providing a cooling fin arrangement within the unitary case; and securing a lid to the wall on each of the other of the opposite surfaces of the two case sides for hermetically sealing the case. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
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Specification