Encapsulated electronic package

  • US 5,313,365 A
  • Filed: 06/30/1992
  • Issued: 05/17/1994
  • Est. Priority Date: 06/30/1992
  • Status: Expired due to Term
First Claim
Patent Images

1. An electronic package, comprising:

  • a printed circuit board having a metal circuit pattern disposed on a first major surface thereof;

    a semiconductor device attached to the printed circuit board by means of an adhesive;

    an encapsulant covering the semiconductor device and portions of the printed circuit board major surface; and

    the adhesive and the encapsulant comprising an organosilicon polymer comprised substantially of alternating polycyclic hydrocarbon residues and cyclic polysiloxane or siloxysilane residues linked through carbon-silicon bonds.

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