Fully integrated single-crystal silicon-on-insulator process, sensors and circuits

• US 5,343,064 A
• Filed: 03/18/1988
• Issued: 08/30/1994
• Est. Priority Date: 03/18/1988
• Status: Expired due to Fees

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Wise, Kensall D., Spangler, Leland J.
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Ngo, Ngan Van
• Application Number:
  US07/169,788
• Time in Patent Office: 2,356 Days
• Field of Search: 357/26, 257/350, 257/352, 257/418
• US Class Current: 257/350
• CPC Class Codes: B81C 1/00246 Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H10N 39/00 Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Abstract

Integrated semiconductor-on-insulator (SOI) sensors and circuits which are electrostatically bonded to a support substrate, such as glass or an oxidized silicon wafer, are disclosed. The SOI sensors and SOI circuits are both formed using a novel fabrication process which allows multiple preformed and pretested integrated circuits on a silicon wafer to be electrostatically bonded to the support substrate without exposing the sensitive active regions of the electronic devices therein to a damaging electric field. The process includes forming a composite bonding structure on top of the integrated circuits prior to the bonding step. This composite structure includes a conductive layer dielectrically isolated from the circuit devices and electrically connected to the silicon wafer, which is spaced form but laterally overlaps at least the active semiconductive regions of the circuit devices. The SOI sensors each include a transducer and at least one active electronic device, which are both made at least in part from a common layer of lightly-doped single-crystal semiconductor material grown on the silicon wafer. After the bonding step, the bulk of the single-crystal wafer is removed, leaving the epitaxial layer containing the circuits and transducers. The epitaxial layer is then patterned into isolated mesas to dielectrically isolate the electronic devices. This patterning step also exposes bond pads, allowing external connections to be readily made to the sensors and circuits. Exemplary solid-state sensors disclosed herein include a capacitive accelerometer and pressure sensor.

Claims

1. A microelectronic structure having a plurality of electronic devices, comprising:

a solid-state circuit structure having at least two distinct electronic devices electrically interconnected to one another, each of the devices having at least one active region of single-crystal semiconductor material formed from a common layer of unrecrystallized bulk, epitaxially grown single-crystal semiconductor material;

a support substrate; and

insulating means disposed permanently and rigidly between the circuit structure and the support substrate, the insulating means being permanently joined to the circuit structure and electrostatically bonded to the support substrate, and including therein means for enabling the insulating means while permanently joined to the circuit structure to be electrostatically bonded to the support substrate without subjecting the active regions of the devices to a damaging electric field.

2. A structure as in claim 1, wherein:

the insulating means for enabling includes first and second layers of insulating material and a first layer of conductive material located between the first and second layers of insulating material, with the first layer of insulating material being disposed between the circuit structure and the first layer of conductive material, and the second layer of insulating material being disposed between the first layer of conductive material and the support substrate; and

the first layer of insulating material includes at least one opening therein for enabling direct electrical contact to be made to the first layer of conductive material so that an electric field can be applied across at least the second layer of insulating material during the bonding step.

3. A microelectronic structure as in claim 2, wherein:

the support substrate is formed at least primarily of glass;

the electronic devices are field effect transistors each having a source and drain, and the active region of each transistor is a channel region between its source and drain;

the first layer of conductive material is selected from the group consisting of high-temperature refractory material, semiconductor material, and a combination of more than one thereof;

the first and second layers of insulating materials include at least a portion thereof made of insulating material selected from the group consisting of silicon oxide, silicon nitride, siliconoxynitride and silicate glass.

4. A microelectronic structure as in claim 1 wherein:

the first layer of insulating material has a thickness equal to at least several tens of nanometers, thereby reducing the parasitic capacitance between the first layer of conductive material and the electronic devices; and

the electronic devices are silicon-on-insulator devices formed at least in part in distinct mesas of single-crystal silicon semiconductor material which mesas were initially part of the common layer of epitaxially grown single-crystal semiconductor material, whereby some of the devices are dielectrically isolated from one another, and electrically joined only through intended conduction paths.

5. An integrated solid-state sensor, comprising:

a solid-state transducer structure having at least one electronically detectable characteristic which varies in response to variations in a physical condition present in the local environment of the transducer, the transducer structure being made at least in part from a first layer of unrecrystallized single-crystal semiconductor material formed from a bulk silicon wafer;

a solid-state electronic device having (1) at least one active region thereof formed at least in part of the first layer of single-crystal semiconductor material, (2) means for electrically interconnecting the device to the to the transducer structure, and (3) means for producing an electrical signal which varies in response to the electronically detectable characteristic of the transducer structure;

a support substrate; and

insulating means permanently and rigidly joined between the electronic device and the support substrate, the insulating means being electrostatically bonded to the support substrate, and including therein means for enabling the insulating means while permanently joined to the electronic device to be electrostatically bonded to the support substrate without subjecting the active region of the device to a damaging electric field.

6. A sensor as in claim 5, wherein:

the first layer of single-crystal semiconductor material is part of a common layer of epitaxially grown single-crystal semiconductor material; and

the insulating means for enabling includes first and second layers of insulating material and a first layer of conductive material located between the first and second layers of insulating material, with the first layer of insulating material being disposed between the electronic device and the first layer of conductive material, and the second layer of insulating material being disposed between the first layer of conductive material and the support substrate, and the first layer of insulating material includes at least one opening therein through which direct electrical contact is made between the common layer of epitaxially grown single-crystal semiconductor material and the first layer of conductive material, whereby an electric field applied during the electrostatic bonding step is diverted from the active region of the electronic device and applied primarily across the second layer of insulating material and support substrate.

7. A sensor as in claim 6, wherein:

the support substrate is formed at least primarily of glass;

the electronic device is a field effect transistor each having a source and drain, and the active region of each transistor is a channel region between its source and drain;

a first layer of conductive material is selected from the group consisting of high temperature refractory material, semiconductor material, and a combination of more than one thereof;

the first layer of insulating material includes material selected from the group consisting of silicon oxide, silicon nitride, siliconoxynitride and silicate glass; and

the second layer of insulating material includes material selected from the group consisting of silicon oxide, silicon nitride, siliconoxynitride and silicate glass.

8. A sensor as in claim 6, wherein the transducer is selected from the group of transducers consisting of capacitive acccelerometers and capacitive pressure sensors, the support substrate is made at least primarily of glass, and the semiconductor material includes silicon as one of its primary constituents, and the transducer further comprises:

a solid-state electronic circuit structure for processing the signal from the transducer and including the first device and at least a second electronic device electrically connected to the first device, the second device including at least one active region thereof formed at least in part of the first layer of single-crystal semiconductor material; and

bond pad means for enabling external electrical connections to be readily made to the sensor, the bond pad means including at least one substantially planar layer of highly conductive material disposed above the surface of the insulating means opposite from the support substrate at approximately the same distance from the support substrate as the active regions of first and second devices.