Integral extended surface cooling of power modules

• US 5,349,498 A
• Filed: 12/23/1992
• Issued: 09/20/1994
• Est. Priority Date: 12/23/1992
• Status: Expired due to Term

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Goodarzi, Gholam A., Olaveson, Richard J., Tanzer, Herbert J.
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US07/995,444
• Time in Patent Office: 636 Days
• Field of Search: 174/16.3, 165/80.4, 165/104.33, 165/185, 257/714, 361/382, 361/384, 361/338
• US Class Current: 361/689
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

The semiconductor wafer of the power module is mounted directly, separated only by thermal expansion control layers and insulator layers, on the metal base which has fins or pins integrally formed thereon. This module is mounted on a coolant fluid flow chamber so that the module mounting is not a thermal interface. In this way, maximum power module cooling is achieved with minimum fluid flow.

Claims

1. A power module cooling system comprising:

a cold plate comprising a fluid inlet and a fluid outlet, a channel interconnecting said fluid inlet and said fluid outlet, and a mounting face having an opening therein into said channel;

a power module disposed on said cold plate, said power module comprising a metallic base that is larger than said opening in said mounting face of said cold plate so that said metallic base overlies said cold plate around said opening to seal against said cold plate adjacent said opening, said metallic base comprising metallic fins that are disposed through said opening in said face of said cold plate into said channel so that coolant fluid flow through said cold plate passes said fins wherein said fins are secured to a side of said channel opposite said opening into said channel, said metallic base comprising a mounting face on said metallic base opposite said fins; and

a semiconductor wafer disposed on said mounting face of said metallic base so that heat generated in said semiconductor wafer moves directly through said metallic base and said fins into said coolant fluid in said channel.

2. The system of claim 1 wherein said base is removably secured to said cold plate to provide for interchangeability of said base and said semiconductor wafer disposed thereon.

3. The system of claim 1 wherein a cover is mounted on said base, said cover being positioned to extend over said semiconductor wafer.

4. The system of claim 3 wherein said cover comprises dielectric material.

5. The system of claim 1 wherein said power module is removably mounted on said mounting face of said cold plate.

6. The system of claim 1 wherein a gasket is incorporated with said power module and said face of said cold plate which is used to assist in sealing against said cold plate adjacent said opening to eliminate coolant leaks out of said opening in said mounting face of said cold plate.

7. The system of claim 1 wherein said semiconductor wafer comprises a plurality of layers to electrically insulate said wafer from said base and to accommodate for differences in thermal coefficients of expansion between said wafer and said base.