Semiconductor device-encapsulating epoxy resin composition
First Claim
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1. A semiconductor device-encapsulating epoxy resin composition comprising(i) an epoxy resin (A) containing as the essential component thereof a bifunctional epoxy resin (a 1) having a biphenyl skeleton, represented by the following formula (I):
- ##STR6## wherein R1 through R8 independently represent hydrogen atom, halogen atom or a lower alkyl group having 1 to 4 carbon atoms,(ii) a curing agent, and(iii) a filler containing a fused silica (C) consisting of 97 to 50 wt % of crushed fused silica (C1) of a mean particle diameter not more than 10 μ
m and 3 to 50 wt % of spherical fused silica (C2) of a mean particle diameter not more than 4 μ
m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler being 75 to 90 wt % to the total of the composition.
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Abstract
Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.
37 Citations
7 Claims
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1. A semiconductor device-encapsulating epoxy resin composition comprising
(i) an epoxy resin (A) containing as the essential component thereof a bifunctional epoxy resin (a 1) having a biphenyl skeleton, represented by the following formula (I): - ##STR6## wherein R1 through R8 independently represent hydrogen atom, halogen atom or a lower alkyl group having 1 to 4 carbon atoms,
(ii) a curing agent, and (iii) a filler containing a fused silica (C) consisting of 97 to 50 wt % of crushed fused silica (C1) of a mean particle diameter not more than 10 μ
m and 3 to 50 wt % of spherical fused silica (C2) of a mean particle diameter not more than 4 μ
m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler being 75 to 90 wt % to the total of the composition. - View Dependent Claims (4, 5)
- ##STR6## wherein R1 through R8 independently represent hydrogen atom, halogen atom or a lower alkyl group having 1 to 4 carbon atoms,
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2. A semiconductor device-encapsulating epoxy resin composition comprising
(i) an epoxy resin (A) containing as the essential component thereof a bifunctional epoxy resin (a2) having a naphthalene skeleton, represented by the following formula (II): - ##STR7## wherein two of R9 to R16 independently represent ##STR8## and those remaining independently represent hydrogen atom, halogen atom or a lower alkyl group having 1 to 4 carbon atoms,
(ii) a curing agent, and (iii) a filler containing a fused silica (C) consisting of 97 to 50 wt % of crushed fused silica (C1) of a mean particle diameter not more than 10 μ
m and 3 to 50 wt % of spherical fused silica (C2) of a mean particle diameter not more than 4 μ
m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler being 75 to 90 wt % to the total of the composition. - View Dependent Claims (6, 7)
- ##STR7## wherein two of R9 to R16 independently represent ##STR8## and those remaining independently represent hydrogen atom, halogen atom or a lower alkyl group having 1 to 4 carbon atoms,
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3. A semiconductor device-encapsulating epoxy resin composition comprising:
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(i) an epoxy resin (A) containing as an essential component thereof at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton represented by the following formula (I) ##STR9## wherein R1 to R8 independently represent hydrogen, a halogen or a lower alkyl group having 1 to 4 carbon atoms, or a bifunctional epoxy resin (a2) having a naphthalene skeleton represented by the following formula (II) ##STR10## wherein two of R 9 to R 16 independently represent ##STR11## and those remaining independently represent hydrogen, a halogen or a lower alkyl group having 1 to 4 carbon atoms; (ii) a phenolic curing agent (B), the amount of said epoxy resin (A) and said curing agent (B) being such that a chemical equivalent ratio of said curing agent (B) to said epoxy resin (A) is in a range of 0.7 to 1.3; and (iii) a filler containing a fused silica (C) consisting of 97 to 50 wt % of crushed fused silica (C1) of a mean particle diameter not more than 10 μ
m and 3 to 50 wt % of spherical fused silica (C2) of a mean particle diameter not more than 4 μ
m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler being 75 to 90 wt % to the total of the composition.
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Specification
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Current AssigneeSumitomo Bakelite Company Limited
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Original AssigneeToray Industries Incorporated
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InventorsKayaba, Keiji, Teshiba, Toshihiro, Tanaka, Masayuki, Honda, Shiro, Sawamura, Yasushi
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Primary Examiner(s)KRASS, FREDERICK F
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Application NumberUS07/990,000Time in Patent Office690 DaysField of Search523/220, 523/223, 523/443, 523/427, 523/434US Class Current523/220CPC Class CodesC08G 59/226 Mixtures of di-epoxy compoundsC08G 59/245 aromaticC08K 7/18 inorganicC08L 63/00 Compositions of epoxy resin...H01L 23/293 Organic, e.g. plasticH01L 2924/00 Indexing scheme for arrange...H01L 2924/0002 Not covered by any one of g...
