Photoelectric sensor assembly with transparent housing an integrally molded lens

• US 5,365,062 A
• Filed: 03/14/1994
• Issued: 11/15/1994
• Est. Priority Date: 10/05/1992
• Status: Expired due to Term

• Current Assignee: Eaton Corp. (Wisconsin) (Eaton Corporation PLC.)
• Original Assignee: Eaton Corp. (Wisconsin) (Eaton Corporation PLC.)
• Inventors: Wolf, Jeffrey J., Medema, Jerry A., Camps, Francis W., Turner, Charles J., Saffari, Akbar
• Primary Examiner(s): Nelms, David C.
• Application Number:
  US08/212,410
• Time in Patent Office: 246 Days
• Field of Search: 250/216, 250/238, 250/239, 250/221, 250/222.1
• US Class Current: 250/239
• CPC Class Codes: G01V 8/10 Detecting, e.g. by using light barriers by reflection from the object G01S17/00
• CPC Class Codes: G12B 9/08 Supports; Devices for carrying

Abstract

A low cost assembly comprising only three major components: a circuit board assembly, a molded plastic housing and a molded plastic cover. The plastic parts are transparent polycarbonate (natural "Lexan") wherein the housing has an integrally molded optical quality lens. Mounting features are integrally molded on the housing and cover. The circuit board assembly uses a common board, trace pattern and terminals and can be either a source or detector by appropriate selection of electronic components mounted to the board. A plurality of rounded bosses on the housing and larger round recesses in edges of the circuit board provide a light interference fit between housing and board to firmly hold the board in place and provide correct orientation of the board relative to the housing. The board may be readily removed and replaced for field repair of the sensor.

Claims

1. A through beam photoelectric sensor assembly comprising:

a molded transparent plastic housing comprising a chamber open to one side of said housing, a focusing lens portion integrally molded in a wall of said housing defining said chamber, said wall being opposite said open side, and a mounting block portion extending away from said chamber;

a circuit board positioned in said chamber at said open side, said circuit board comprising wiring terminals projecting from one surface of said board and a photoelectric device on an opposite surface of said board, said photoelectric device being disposed within said chamber and facing said lens portion;

a molded plastic cover overlying said open side of said housing and said circuit board, said cover comprising openings for said wiring terminals and a clamp portion extending therefrom substantially coextensive with and spaced from said mounting block portion;

aligned holes in said mounting block portion and said clamp portion; and

fastener means extending through respective said aligned holes for contemporaneously securing said cover to said housing and clamping said sensor assembly to a mounting member.

2. The through beam photoelectric sensor assembly defined in claim 1 wherein mutually adjacent sides of said mounting block portion and said clamp portion have aligned recesses which cooperatively define an opening for said mounting member.

3. The through beam photoelectric sensor assembly defined in claim 2 wherein said recesses are substantially semicylindrical and substantially define a circle with said clamp portion and said mounting block portion coextensively disposed.

4. The through beam photoelectric sensor assembly defined in claim 2 wherein at least one of said mounting block portion and said clamp portion have straight-sided counterbore pockets formed concentric with respective said aligned holes, and said fastener means comprises screws extending through said aligned holes and threaded nuts disposed in said straight-sided counterbore pockets threadably engaged by said screws.

5. The through beam photoelectric sensor assembly defined in claim 1 wherein said photoelectric device is selected from a group consisting of photoelectric sources and photoelectric detectors.

6. The through beam photoelectric sensor assembly defined in claim 5 wherein said circuit board comprises conductive traces connected to said wiring terminals and said photoelectric device, said circuit board, said traces and said wiring terminals being identical for either said selected photoelectric device mounted to said circuit board.

7. The through beam photoelectric sensor assembly defined in claim 6 wherein said housing comprises a plurality of bosses in said chamber adjacent said open side and said circuit board comprises a corresponding plurality of recesses in side edges thereof, said bosses and said recesses being arranged to insure predetermined orientation of said circuit board to said housing, and to provide an interference fit for said circuit board in said housing chamber.

8. The through beam photoelectric sensor assembly defined in claim 7 wherein said bosses and said recesses are substantially semicylindrical, a radius defining respective said recesses being larger than a corresponding radius defining respective said bosses for effecting single-point engagement of a respective boss within a respective recess.

9. The through beam photoelectric sensor assembly defined in claim 8 wherein said single-point engagement of said bosses and said recesses provide an interference fit for mounting said circuit board in said housing chamber.