Method and apparatus for positioning an integrated circuit device in a test fixture

• US 5,376,882 A
• Filed: 09/16/1992
• Issued: 12/27/1994
• Est. Priority Date: 09/16/1992
• Status: Expired due to Term

• Current Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Johnson, Douglas S.
• Primary Examiner(s): NGUYEN, VINH P
• Application Number:
  US07/945,479
• Time in Patent Office: 832 Days
• Field of Search: 324/158 F, 324/158 P, 324/72.5, 324/158 R, 439/482, 439/67, 439/68, 439/69, 439/70
• US Class Current: 324/750.24
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence

Abstract

A method and an apparatus are disclosed for positioning an integrated circuit chip to be tested on a device-under-test ("DUT") interface board without using a hold-down plate and for attaching this interface board to a feed-through interface module so that the device being tested makes abutting contact with the feed-through interface module and so that the contact pins of the device being tested make abutting electrical contact with contact pin sockets on the DUT interface board. This arrangement provides a path for heat and ion dissipation from the chip being tested in a simple and elegant manner which also minimizes potential damage to the chip.

Claims

1. In an integrated circuit ("IC") test system, which includes at least one IC chip having a plurality of contact pins (the "DUT"), and which includes a feed-through interface module, and which also includes an interface board for mounting the DUT, a method for positioning the DUT in the test system comprising the following steps:

a. positioning DUT on the DUT interface board;

b. positioning a conductive spacer in contact with the DUT; and

c. attaching the DUT interface board with the DUT to the feed-through interface module so that the conductive spacer makes abutting contact with the feed-through interface module, and the DUT contact pins make abutting electrical contact with the DUT interface board.

2. The method according to claim 1 wherein the conductive spacer connected to the DUT makes abutting contact with a center block of the feed-through interface module when the DUT interface board is attached to the feed-through interface module.

3. The method according to claim 2 wherein the test system is a Schlumberger IDS5000Plus e-beam probe station.

4. The method according to claim 3 wherein the feed-through interface module is a universal load module containing a plurality of electrical contacts which make abutting contact with the DUT interface board, providing a signal path from the DUT interface board through the universal load module.

5. The method according to claim 4 wherein the DUT interface board contains a plurality of spring sockets for making abutting electrical contact with the contact pins of the DUT.

6. The method according to claim 5 comprising the additional step of adjusting, said spacer'"'"'s thickness whenever a new DUT is inserted into said test system, based upon said new DUT'"'"'s thickness.

7. The method according to claim 6 wherein a combined thickness of the spacer and thickness of the feed-through interface module is adjusted as a function a distance between a top of the feed-through interface module to a top of the DUT board and the new DUT'"'"'s thickness.

8. The method according to claim 2 wherein the DUT interface board contains a plurality of spring sockets.

9. The method according to claim 8 wherein the DUT contact pins make abutting electrical contact with the DUT interface board spring sockets.

10. The method according to claim 9 comprising the additional step of adjusting a combined thickness of a spacer and thickness of the feed-through interface module as a function of the distance between a top of the feed-through interface module to a top of the DUT interface board in a mounted position, and the DUT'"'"'s thickness, wherein the spacer makes abutting contact with an inner surface of the center block of the feed-through interface module.

11. The method according to claim 1 wherein the feed-through interface module further comprises a feed-through interface center block.

12. In an integrated circuit ("IC") test system, which includes at least one IC chip having a plurality of contact pins referred to as a device under test ("DUT"), and which includes a feed-through interface module, an apparatus for positioning the DUT in the test system comprising:

a. a DUT interface board coupled to the DUT;

b. a conductive spacer mounted in contact with the DUT; and

c. the feed-through interface module connected to the DUT interface board, so that the conductive spacer makes abutting contact with the feed-through interface module, and the DUT contact pins make abutting electrical contact with the DUT interface board.

13. The apparatus according to claim 12 wherein physical connections for discharging heat generated by the DUT and for discharging electrical charge which may have built up on the DUT are provided through the spacer'"'"'s abutting contact to a center block of the feed-through interface module.

14. The apparatus according to claim 12 wherein the DUT interface board comprises a plurality of spring sockets.

15. The apparatus according to claim 14 wherein the DUT contact pins make abutting electrical contact with the DUT interface board spring sockets.

16. The apparatus according to claim 15 wherein the spacer'"'"'s thickness has been adjusted so that a combined thickness of the spacer and thickness of the feed-through interface module is a function of a distance between a top of the feed-through interface module to a top of the DUT board and the DUT'"'"'s thickness, thereby permitting said abutting contact without excessive pressure on said DUT contact pins.

17. The apparatus according to claim 12 wherein the feed-through interface module further comprises a feed-through interface center block, which is designed to make abutting electrical and thermal contact with said spacer.

18. The apparatus according to claim 12 wherein the test system is a Schlumberger IDS5000Plus e-beam probe station.

19. The apparatus according to claim 18 wherein the feed-through interface module is a universal load module having a center block and containing a plurality of electrical contacts which make abutting contact with the DUT interface board, providing a signal path from the DUT interface board through the universal load module.

20. The apparatus according to claim 19 wherein the DUT interface board contains a plurality of spring sockets for making abutting electrical contact with the contact pins of the DUT.

21. The apparatus according to claim 20 wherein the spacer'"'"'s thickness has been adjusted so that a combined thickness of the spacer and thickness of the feed-through interface center block is a function of a distance between a top of the feed-through interface centerblock to a top of the DUT board, and the DUT'"'"'s thickness, thereby permitting said abutting contact without excessive pressure on said DUT contact pins.