Packaged integrated circuit including heat slug having an exposed surface

• US 5,381,042 A
• Filed: 04/19/1994
• Issued: 01/10/1995
• Est. Priority Date: 03/31/1992
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Electronics, Inc. (Amkor Technology Incorporated)
• Inventors: Razu, David S., Lerner, Steve P.
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US08/231,341
• Time in Patent Office: 266 Days
• Field of Search: 257/707, 257/720, 257/706, 257/675, 257/712, 257/713, 257/720, 257/722
• US Class Current: 257/712
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A low cost electronic device package having greatly improved heat dissipation capability. The package includes a heat slug, preferably formed from oxygen-free high-conductivity copper, that has a surface exposed outside the package. A simplified and inexpensive manufacturing method is described using a "drop in" technique. Using this technique, the size and shape of the heat slug is dependent only on the size and shape of the mold cavity; the package may have any number of leads and any size die. The heat slug is preferably formed with fins around its circumference so that the slug is self-aligning when it is dropped into the mold cavity. Preferably, slots are formed through the heat slug to provide improved encapsulant flow during the encapsulation process and interlocking between slug and encapsulant in the finished package. The heat slug may have at least one toughened surface on its circumference that interlocks with the encapsulant, helping to hold the heat slug in place and preventing contaminants from migrating to the interior of the package. Formation of encapsulant bleed or flash on the exposed heat slug surface are prevented by providing a dimensional mismatch between the heat slug and leadframe, and the corresponding height of the mold cavity that causes the leadframe tie bars to force the heat slug exposed surface against the mold cavity surface, producing a tight seal so that encapsulant is prevented from coming between those two surfaces.

Claims

1. A structure, comprising:

a semiconductor die;

a leadframe comprised of a die attach pad and a plurality of electrically conductive leads, wherein;

the leads are formed around a circumference of and are electrically isolated from the die attach pad; and

the die attach pad has first and second surfaces, the first surface attached to a surface of the semiconductor die, the second surface being opposite the first surface;

a heat slug including;

a base section having a first base surface and a second base surface opposite the first base surface, a plurality of fins formed on a surface perpendicular to the first and second base surfaces at spaced apart locations around the circumference of the base section;

a first raised section formed on the first base surface having a die attach pad attachment surface parallel to and raised with respect to the first base surface, the die attach pad attachment surface attached to the second surface of the die attach pad; and

a second raised section formed on the second base surface having a primary heat transfer surface parallel to and raised with respect to the second base surface, a surface of the second raised section that is perpendicular to the primary heat transfer surface being roughened; and

insulating material encapsulating the semiconductor die, leadframe and heat slug such that the primary heat transfer surface of the heat slug is exposed to the exterior of the insulating material and such that the insulating material interlocks with the roughened surface of the second raised section;

2. A structure as in claim 1, wherein the heat slug is made of oxygen-free high-conductivity copper.

3. A structure as in claim 1, wherein at least one slot is formed through the base section of the heat slug to extend from the first base surface to the second base surface.

4. A structure as in claim 1, further comprising an adhesive material that attaches the die attach pad attachment surface of the heat slug to the second surface of the die attach pad.

5. A structure as in claim 1, formed by a method comprising the steps of:

attaching the semiconductor die to the first surface of the die attach pad;

disposing the semiconductor die and leadframe in a mold cavity formed in a mold having first and second halves;

restraining an outer portion of the leadframe by mounting it to the first half of the mold at a location outside the mold cavity;

disposing the heat slug in the mold cavity such that the die attach pad attachment surface of heat slug is adjacent to the second surface of the die attach pad;

pressing the second half of the mold against the primary heat transfer surface of the heat slug such that the heat slug is forced against the die attach pad and the leadframe exerts a force that holds the primary heat transfer surface of the heat slug against the corresponding surface of the mold cavity;

transferring the insulating material into the mold cavity while the primary heat transfer surface of the heat slug is held against the corresponding surface of the mold cavity such that a tight seal is maintained between the heat slug and mold cavity surface.

6. A structure as in claim 5, wherein the heat slug is self-aligning such that when the heat slug is disposed within the mold cavity, the heat slug is oriented properly with respect to the die attach pad.

7. A structure, comprising:

a semiconductor die, the die having a plurality of die contact pads located on a first surface of the die and a second surface opposite the first surface;

a leadframe comprised of a die attach pad, a plurality of tie bars and a plurality of electrically conductive leads, wherein;

the tie bars and the leads are formed around a circumference of the die attach pad;

an inner end of each tie bar is connected to the die attach pad;

an inner end of each lead is adjacent to and electrically isolated from the die attach pad; and

the die attach pad has first and second surfaces, the first surface attached to the second surface of the semiconductor die, the second surface being opposite the first surface;

a plurality of electrically conductive bond wires, each bond wire connecting a die contact pad to the inner end of one of the leads;

a heat slug including;

a base section having a first base surface and a second base surface Opposite the first base surface, a plurality of fins formed on a surface perpendicular to the first and second base surfaces at spaced apart locations around the circumference of the base section;

a first raised section formed on the first base surface having a die attach pad attachment surface parallel to and raised with respect to the first base surface, the die attach pad attachment surface attached to the second surface of the die attach pad; and

a second raised section formed on the second base surface having a primary heat transfer surface parallel to and raised with respect to the second base surface, a surface of the second raised section that is perpendicular to the primary heat transfer surface being roughened; and

an insulating material encapsulating the semiconductor die, leadframe, bond wires and heat slug such that the primary heat transfer surface of the heat slug is exposed to the exterior of the insulating material, and such that the insulating material interlocks with the roughened surface of the second raised section.

8. A structure as in claim 7, wherein the heat slug is made of oxygen-free high-conductivity copper.

9. A structure as in claim 7, wherein

at least one slot is formed through the base section of the heat slug to extend from the first base surface to the second base surface.

10. A structure as in claim 7, further comprising an adhesive material that attaches the die attach pad attachment surface of the heat slug to the second surface of the die attach pad.

11. A structure as in claim 7, formed by method comprising the steps of:

attaching the semiconductor die to the first surface of the die attach pad;

connecting one end of each bond wire to a die contact pad and the other end of each bond wire to the inner end of a lead;

disposing the semiconductor die, leadframe and bond wires in a mold cavity formed in a mold having first and second halves;

restraining an outer portion of the leadframe by mounting it to the first half of the mold at a location outside the mold cavity;

disposing the heat slug in the mold cavity such that the die attach pad attachment surface of the heat slug is adjacent to the second surface of the die attach pad;

pressing the second half of the mold against the primary heat transfer surface of the heat slug such that the heat slug is forced against the die attach pad and the tie bars exert a force that holds the primary heat transfer surface of the heat slug against the corresponding surface of the mold cavity;

transferring the insulating material into the mold cavity while the primary heat transfer surface of the heat slug is held against the corresponding surface of the mold cavity such that a tight seal is maintained between the heat slug and mold cavity surface.

12. A structure as in claim 11, wherein the heat slug is self-aligning such that when the heat slug is disposed within the mold cavity, the heat slug is oriented properly with respect to the die attach pad.

13. A structure, comprising:

a semiconductor die, the die having a plurality of die contact pads located on a first surface of the die and a second surface opposite the first surface;

a leadframe comprised of a die attach pad, a plurality of tie bars and a plurality of electrically conductive leads, wherein;

the tie bars and the leads are formed around a circumference of the die attach pad;

an inner end of each tie bar is connected to the die attach pad;

an inner end of each lead is adjacent to and electrically isolated from the die attach pad; and

the die attach pad has first and second surfaces, the first surface attached to the second surface of the semiconductor die;

a plurality of electrically conductive bond wires, each bond wire connecting a die contact pad to the inner end of one of the leads;

an oxygen-free high-conductivity copper heat slug comprising;

a base section having a first base surface and a second base surface opposite the first base surface;

a first raised section formed on the first base surface having a die attach pad attachment surface parallel to and raised with respect to the first base surface, the die attach pad attachment surface attached to the second surface of the die attach pad;

a second raised section formed on the second base surface having a primary heat transfer surface parallel to and raised with respect to the second base surface;

at least one surface of the second raised section that is perpendicular to the primary heat transfer surface being roughened;

at least one slot formed through the base section of the heat slug to extend from the first base surface to the second base surface; and

a plurality of fins formed on a surface perpendicular to the first and second base surfaces at spaced apart locations around the circumference of the base section; and

insulating material encapsulating the semiconductor die, leadframe, bond wires and heat slug such that the primary heat transfer surface of the heat slug is exposed to the exterior of the insulating material, and such that the insulating material interlocks with the roughened surface of the second raised section.

14. A heat slug, comprising:

a base section having a first base surface and a second base surface opposite the first base surface, a plurality of fins formed on a surface perpendicular to the first and second base surfaces at spaced apart locations around the circumference of the base section;

a first raised section formed on the first base surface having a die attach pad attachment surface parallel to and raised above the first base surface; and

a second raised section formed on the second base surface and having a primary heat transfer surface parallel to and raised above the second base surface, a surface of the second raised section that is perpendicular to the primary heat transfer surface being roughened.

15. A heat slug as in claim 14 wherein the heat slug is made of oxygen-free high-conductivity copper.

16. A heat slug as in claim 14, further comprising at least one slot formed through the heat slug from the first base surface to the second base surface at a location near the periphery of the heat slug.