Multiprocessor module packaging

• US 5,391,917 A
• Filed: 05/10/1993
• Issued: 02/21/1995
• Est. Priority Date: 05/10/1993
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Gilmour, Richard J., Schrottke, Gustav
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): BROWN, PETER T
• Application Number:
  US08/058,892
• Time in Patent Office: 652 Days
• Field of Search: 257/690, 257/723, 257/666, 257/724, 257/777, 257/778
• US Class Current: 257/690
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/5382 Adaptable interconnections, e.g. for engineering changes
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/19041 being a capacitor

Abstract

A function module using technology which allows conductive vias to be formed in a silicon substrate in order to fabricate three dimensional multifunctional processor system is described. A silicon or other semiconductor carrier having embedded active devices therein is used as a substrate for complex functional elements disposed on both sides thereof. The semiconductor substrate includes conductive vias formed therein which interconnect single chips or multichip modules disposed on either side thereof. Using drilling/plating techniques for wafer substrates electrically interconnected devices are placed on opposite sides of the substrate. Multichip modules (MCM) including the desired functions are then fabricated having input/output (I/Os) connection points which correspond to the vias formed in the substrate. This interconnection between the MCMs and the substrate may be accomplished by providing circuitized lines and connection pads on a dielectric layer, with conductive vias therein, which is subsequently placed on the active substrate. A dielectric layer having circuitized lines therein can then be extended outwardly from the module in order to provide electrical connection to input output devices, e.g. keyboard, display, or the like, as well as other system components, such as like multifunctional elements.

Claims

1. A functional module for providing processing operations in a computer system, comprising:

a semiconductor substrate having at least one active circuit device with exposed connection points embedded therein;

at least one first circuit device including a central processing unit configured as at least one individual integrated circuit device disposed on a first side of said substrate and interconnected with said at least one embedded circuit device;

at least one second circuit device including at least one memory device disposed on a second side of said substrate, and interconnected to said at least one embedded circuit device and said at least one first circuit device;

a plurality of conductive vias extending through said semiconductor substrate to interconnect said at least one circuit device said at least one second circuit device; and

at least one wiring layer flexibly extending from said nodule and including interconnection means for interconnecting said functional module with another functional module and an input/output device, said at least one wiring layer being adjacent said substrate for wiring one of said at least one first circuit device and said at least one second circuit device to said at least one embedded circuit device.

2. A module according to claim 1 wherein said semiconductor substrate is a wafer and said at least one embedded device is a cross point switch.