Layout design to eliminate process antenna effect

• US 5,393,701 A
• Filed: 04/08/1993
• Issued: 02/28/1995
• Est. Priority Date: 04/08/1993
• Status: Expired due to Term

• Current Assignee: United Microelectronics Corporation
• Original Assignee: United Microelectronics Corporation
• Inventors: Ko, Joe, Hsu, Bill
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Booth, Richard A.
• Application Number:
  US08/044,931
• Time in Patent Office: 691 Days
• Field of Search: 437/193, 437/195, 437/51, 437/186, 437/923, 437/228
• US Class Current: 438/612
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: Y10S 438/91 Controlling charging state at semiconductor-insulator interface

Abstract

A multi-level conductive interconnection for an integrated circuit is formed in a silicon substrate, wherein there are large contact pad areas at the periphery of the interconnection. A patterned layer of a conductive polysilicon is formed on the substrate to act as a first conductive contact to the integrated circuit. An insulating layer is formed over the polysilicon layer, and openings to the polysilicon layer are formed through the insulating layer. A first layer of metal is formed on the insulator such that the metal electrically connects to the polysilicon through the openings, and also forming large contact pad areas. The first metal is patterned to form an electrical break between the large contact pad areas and the integrated circuit. This break prevents electrical damage to the integrated circuit due to charge build-up during subsequent processing in a plasma environment. A second insulating layer is formed and patterned to provide openings for vias to the first metal layer. A second layer of metal is formed over the large contact pad area and over the electrical break such that the second metal electrically connects to the first metal, via direct contact to the first metal at the large contact pad area, and through the openings in the second insulator to the first metal interconnection. Finally, a passivation layer is formed over the second metal layer.

Claims

1. A method of forming a multi-level conductive interconnection for an integrated circuit on a silicon substrate, wherein there are contact pad areas at the periphery of said interconnection, comprising:

forming a patterned layer of conductive polysilicon on said substrate to act as a first conductive contact to said integrated circuit;

forming an insulating layer over said polysilicon layer;

forming openings to said polysilicon layer through said insulating layer;

forming a first layer of metal on said insulating layer such that said metal electrically connects to said polysilicon through said openings;

forming said contact pad areas with said first layer of metal;

patterning said first layer of metal to form an electrical break in said first metal interconnection, between said contact pad areas and said integrated circuit, wherein said electrical break electrically isolates said contact pad and said integrated circuit to prevent charge build-up during subsequent processing;

further processing in a plasma environment that would normally produce electrical charge build-up at a gate oxide of said integrated circuit, but wherein said electrical break prevents said normally produced electrical charge build-up;

forming and patterning a second insulating layer to form openings for vias to said first metal layer;

forming a second layer of metal over said contact pad areas and over said electrical break such that said second metal electrically connects to said first metal, via direct contact to said first metal at said contact pad areas and through said openings in said second insulating layer to said first metal interconnection, thereby re-connecting said contact pad areas and said integrated circuit; and

forming a passivation layer over said second metal layer.

2. The method of claim 1 wherein said further processing in a plasma environment is plasma enhanced chemical vapor deposition.

3. The method of claim 1 wherein said further processing in a plasma environment is plasma etching.

4. The method of claim 3 wherein said plasma etching is a sputter etch.

5. The method of claim 1 wherein the size of said contact pad areas is greater than about 30×

30 micrometers.

6. The method of claim 1 wherein said contact pad areas are located at the periphery of said integrated circuit.

7. The method of claim 1 further comprising:

patterning said second metal layer at said electrical break to form a second electrical break;

further processing in a plasma environment that would normally produce electrical charge build-up at a gate oxide of said integrated circuit, but wherein said second electrical break prevents said charge build-up;

forming and patterning a third insulating layer to form openings for vias to said second metal layer;

forming a third layer of metal over said contact pad area and over said second electrical break such that said third metal electrically connects to said second metal, via direct contact to said second metal at said contact pad area and through said openings in said third insulating layer to said second metal interconnection at said second electrical break, thereby re-connecting said contact pad area and said integrated circuit; and

forming a passivation layer over said third metal layer.

8. A method of subjecting an integrated circuit, having first metal regions on its surfaces which are electrically connected to device structures, to a plasma process comprising:

electrically breaking said electrical connection to said device structures, thereby isolating said first metal regions from said device structures;

placing said integrated circuit in a chamber for accomplishing said plasma process;

subjecting said integrated circuit to said plasma process wherein said electrically breaking said electrical connection prevents damage to said device structures;

removing said integrated circuit from said chamber; and

reconnecting said first metal regions to said structures by means of a second metal layer.

9. The method of claim 8 wherein the size of said first metal regions is greater that about 30×

30 micrometers.

10. The method of claim 8 wherein said first metal regions are comprised of contact pads located at the periphery of said integrated circuit.

11. The method of claim 8 wherein said second metal layer and said first metal regions are separated by an insulating material, through which via holes are formed to re-connect said first metal regions to said device structures.