Metal electronic package with reduced seal width
First Claim
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1. An electronic package, comprising:
- a base and a cover defining a cavity and a peripheral dimension of said electronic package;
a leadframe disposed between said base and said cover;
an adhesive having a reduced seal width bonding said leadframe both to said base and to said cover thereby providing an increased area cavity;
a semiconductor device electrically interconnected to said leadframe, wherein said semiconductor device and a portion of said leadframe occupy a portion of said cavity; and
a compliant polymer occupying substantially the remainder of said cavity.
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Accused Products
Abstract
There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.
65 Citations
19 Claims
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1. An electronic package, comprising:
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a base and a cover defining a cavity and a peripheral dimension of said electronic package; a leadframe disposed between said base and said cover; an adhesive having a reduced seal width bonding said leadframe both to said base and to said cover thereby providing an increased area cavity; a semiconductor device electrically interconnected to said leadframe, wherein said semiconductor device and a portion of said leadframe occupy a portion of said cavity; and a compliant polymer occupying substantially the remainder of said cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic package, comprising:
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a base and a cover defining a cavity and a peripheral dimension of said electronic package; a leadframe disposed between said base and said cover and bonded to both; a first adhesive having a reduced seal width bonding said leadframe both to said base and to said cover thereby providing an increased area cavity; a thermoplastic second adhesive bonding said leadframe to said cover; a semiconductor device electrically interconnected to said leadframe, wherein said semiconductor device and a portion said leadframe occupy a portion of said cavity; and a compliant polymer occupying substantially the remainder of the cavity. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification