Ultra high density modular integrated circuit package
DCFirst Claim
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1. A modular integrated circuit package comprising:
- a plurality of individual integrated circuit packages, each comprising;
an integrated circuit element, said integrated circuit element comprising an integrated electrical circuit and having a plurality of electrical interconnect leads extending therefrom;
a transfer-molded plastic casing surrounding said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall;
a first metal foil lamination applied to said upper surface of said casing;
a second metal foil lamination applied to said lower surface of said casing;
a planar heat sink element in surface contact with a surface of said integrated circuit element, said heat sink further being formed and mounted so as to extend through a portion of said casing wall;
wherein said leads from said integrated circuit element extend through a portion of said perimeter wall of said casing; and
wherein said plurality of integrated circuit packages are bound together in a vertically oriented assembly, having their said leads extending below the assembly and their heat sink elements extending above the assembly; and
a housing surrounding said assembly, said housing having a first side member and a second side member and a top, said side members and said
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Abstract
A multiple-element modular package is provided which includes a plurality of level-one packages in horizontal or vertical stacked configuration.
220 Citations
32 Claims
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1. A modular integrated circuit package comprising:
- a plurality of individual integrated circuit packages, each comprising;
an integrated circuit element, said integrated circuit element comprising an integrated electrical circuit and having a plurality of electrical interconnect leads extending therefrom; a transfer-molded plastic casing surrounding said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall; a first metal foil lamination applied to said upper surface of said casing; a second metal foil lamination applied to said lower surface of said casing; a planar heat sink element in surface contact with a surface of said integrated circuit element, said heat sink further being formed and mounted so as to extend through a portion of said casing wall; wherein said leads from said integrated circuit element extend through a portion of said perimeter wall of said casing; and
wherein said plurality of integrated circuit packages are bound together in a vertically oriented assembly, having their said leads extending below the assembly and their heat sink elements extending above the assembly; and
a housing surrounding said assembly, said housing having a first side member and a second side member and a top, said side members and said - View Dependent Claims (2, 3, 4, 5, 6, 7)
- a plurality of individual integrated circuit packages, each comprising;
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8. A modular integrated circuit package comprising:
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a plurality of individual level-one integrated circuit packages, each comprising; an integrated circuit element, said circuit element comprising an integrated electrical circuit having a plurality of electrical interconnect leads extending therefrom; a transfer-molded plastic casing surrounding said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall; and wherein said integrated circuit leads extend from said integrated circuit element through a portion of said perimeter wall of said casing; said plurality of level-one packages being assembled in a stacked configuration so that upper and lower surfaces of adjacent level-one packages are parallel to one another to form an assembly with a plurality of intermediate level-one packages flanked by two exterior level-one packages; a high-temperature moisture-resistant adhesive bond layer formed between intermediate level-one packages; a metallic foil lamination applied to the exterior surface of each of said exterior level-one packages. - View Dependent Claims (9, 10, 11, 12)
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13. A modular integrated circuit package comprising:
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a plurality of level-one integrated circuit packages, each comprising; an integrated circuit element, said integrated circuit element comprising an integrated circuit having a plurality of electrical interconnect leads extending therefrom; an external electrically insulating casing surrounding said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall; and
wherein leads extend from said integrated circuit element through a portion of said perimeter wall of said casing;said level-one packages being horizontally oriented in a vertically aligned stacked configuration so that said leads from said level-one packages are aligned in an array of vertical columns; a plurality of vertically oriented, thermally and electrically conductive rails mounted adjacent to said vertical columns of said leads;
said rails being electrically and thermally coupled to said columns of leads. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification