Ultra high density modular integrated circuit package

  • US 5,420,751 A
  • Filed: 10/08/1993
  • Issued: 05/30/1995
  • Est. Priority Date: 08/01/1990
  • Status: Expired due to Term
First Claim
Patent Images

1. A modular integrated circuit package comprising:

  • a plurality of individual integrated circuit packages, each comprising;

    an integrated circuit element, said integrated circuit element comprising an integrated electrical circuit and having a plurality of electrical interconnect leads extending therefrom;

    a transfer-molded plastic casing surrounding said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall;

    a first metal foil lamination applied to said upper surface of said casing;

    a second metal foil lamination applied to said lower surface of said casing;

    a planar heat sink element in surface contact with a surface of said integrated circuit element, said heat sink further being formed and mounted so as to extend through a portion of said casing wall;

    wherein said leads from said integrated circuit element extend through a portion of said perimeter wall of said casing; and

    wherein said plurality of integrated circuit packages are bound together in a vertically oriented assembly, having their said leads extending below the assembly and their heat sink elements extending above the assembly; and

    a housing surrounding said assembly, said housing having a first side member and a second side member and a top, said side members and said

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