Launch-protected electronic assembly

• US 5,426,568 A
• Filed: 12/23/1993
• Issued: 06/20/1995
• Est. Priority Date: 12/23/1992
• Status: Expired due to Term

• Current Assignee: Rheinmetall GmbH
• Original Assignee: Rheinmetall GmbH
• Inventors: Sommer, Peter, Lamers, Johannes, Stoffels, Dietmar, von der Lippe, Norbert
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): SPARKS, DONALD ALAN
• Time in patent office: 544 Days
• Field of Search: 174/254, 174/255, 174/256, 174/257, 174/258, 174/259, 174/260, 361/748, 361/749, 361/750, 361/751, 361/760, 361/784, 361/792-795, 361/807, 361/808, 361/809, 361/810, 361/783, 428/901, 439/67, 439/68, 439/77, 427/96, 427/103, 156/325, 156/326, 156/327, 156/338
• US Class Current: 361/810
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/09872 Insulating conformal coating foil encapsulation H05K2203/1311
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2201/2045 Protection against vibrations
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A launch-protected electronic assembly including a printed circuit board having several conductor paths. An electronic component is provided that is secured to the printed circuit board. The electronic component has several electrical connections each contacting a corresponding conductor path. The assembly further includes a support and at least one of a flexible adhesive layer and a dot-shaped flexible adhesive location connecting the printed circuit board to the support.

Claims

1. A launch-protected electronic assembly, comprising:

a printed circuit board having a plurality of conductor paths;

an electronic component secured to said printed circuit board, said electronic component having a plurality of electrical connections each contacting a corresponding conductor path;

a flexible intermediate disc glued between said printed circuit board and said electronic component;

a support connected to said printed circuit board;

a flexible film disposed between said support and said printed circuit board; and

a polyurethane adhesive securing said flexible film to said printed circuit board and said support.

2. A launch-protected electronic assembly as defined in claim 1, wherein said flexible film has a thickness generally between 0.5 to 3 mm.

3. A launch-protected electronic assembly as defined in claim 1, wherein said flexible film has a thickness generally between 1 to 2 mm.

4. A launch-protected electronic assembly as defined in claim 1, wherein said printed circuit board comprises one of a glass fiber reinforced plastic material, carbon fiber reinforced plastic material, and ceramic hybrid material.

5. A launch-protected electronic assembly as defined in claim 1, wherein said printed circuit board comprises a steel hybrid material.

6. A launch-protected electronic assembly as defined in claim 1, further comprising:

a glass fiber reinforced plastic plate between said electronic component and said printed circuit board; and

an adhesive layer connecting said glass fiber reinforced plastic plate to said electronic component and said printed circuit board.

7. A launch-protected electronic assembly as defined in claim 1, further comprising an electrically insulating coating provided upon said printed circuit board and said electronic component.

8. A launch-protected electronic assembly as defined in claim 1, wherein said flexible film comprises a foamed polyurethane elastomer.

9. A launch-protected electronic assembly, comprising:

a printed circuit board having a plurality of conductor paths;

an electronic component secured to said printed circuit board, said electronic component having a plurality of electrical connections each contacting a corresponding conductor path;

a support connected to said printed circuit board;

a flexible film comprising a foamed polyurethane elastomer disposed between said support and said printed circuit board; and

a polyurethane adhesive securing said flexible film to said printed circuit board and said support.

10. A launch-protected electronic assembly as defined in claim 9, wherein said flexible film has a thickness generally between 0.5 to 3 mm.

11. A launch-protected electronic assembly as defined in claim 9, wherein said flexible film has a thickness generally between 1 to 2 mm.

12. A launch-protected electronic assembly as defined in claim 9, wherein said printed circuit board comprises one of a glass fiber reinforced plastic material, carbon fiber reinforced plastic material, and ceramic hybrid material.

13. A launch-protected electronic assembly as defined in claim 9, wherein said printed circuit board comprises a steel hybrid material.

14. A launch-protected electronic assembly as defined in claim 9, further comprising a flexible intermediate disc glued between said printed circuit board and said electronic component.

15. A launch-protected electronic assembly as defined in claim 9, further comprising:

a glass fiber reinforced plastic plate between said electronic component and said printed circuit board; and

an adhesive layer connecting said glass fiber reinforced plastic plate to said electronic component and said printed circuit board.

16. A launch-protected electronic assembly as defined in claim 9, further comprising an electrically insulating coating provided upon said printed circuit board and said electronic component.