Transponding tag and method
First Claim
1. A tag, said tag being a transponding tag for responding to an interrogation signal, said tag comprising:
- a dielectric member having first and second substantially opposing sides;
a first conductive layer residing on said first side of said dielectric member, said first conductive layer having a slot across which said interrogation signal develops an electrical field;
a second conductive layer residing on said second side of said dielectric member, said second conductive layer being electrically isolated from said first conductive layer; and
an electrical circuit residing within said member, said electrical circuit being electrically coupled to said first layer at opposing sides of said slot.
1 Assignment
0 Petitions
Accused Products
Abstract
A transponding tag (14) and method for responding with a unique code signal (18) when it receives an interrogation signal (16). The tag (14) waits a random duration before responding to avoid interference with response code signals (18) from other tags (14). The tag (14) includes two antennae (22, 24) formed on opposing sides of a dielectric planar substrate (20). A protective coating (52) and printed indicia (72) overlie the antennae. An electrical circuit (34), decoupling capacitor (44) and inductive pickup coil (46) are embedded within the substrate (20). The electrical circuit (34) and capacitor (44) reside between the antennae (22, 24) to receive RF shielding from the antennae and to reduce thickness of the tag (14). A capacitance exists between the antennae (22, 24). This capacitance stores DC electrical energy for the electrical circuit (34). The tag (14) is programmed through a modulated magnetic field detected at the inductive pickup coil (46).
439 Citations
26 Claims
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1. A tag, said tag being a transponding tag for responding to an interrogation signal, said tag comprising:
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a dielectric member having first and second substantially opposing sides; a first conductive layer residing on said first side of said dielectric member, said first conductive layer having a slot across which said interrogation signal develops an electrical field; a second conductive layer residing on said second side of said dielectric member, said second conductive layer being electrically isolated from said first conductive layer; and an electrical circuit residing within said member, said electrical circuit being electrically coupled to said first layer at opposing sides of said slot. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of responding to an interrogation signal, said method comprising steps of:
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receiving said interrogation signal at a transponding tag which includes an antenna having first and second spaced apart conductive layers with at least one slot therein and having an electrical circuit coupled to said antenna, said first and second conductive layers being electrically isolated from each other, wherein said electrical circuit is shielded from said interrogation signal by said first and second layers; energizing said electrical circuit in response to said receiving step; and responding with a response code from said antenna in response to said energizing step. - View Dependent Claims (16, 17, 18, 19)
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20. A tag, said tag being a transponding tag for responding to an interrogation signal, said tag comprising:
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a substantially planar dielectric member having first and second substantially opposing sides; a first conductive layer disposed on said first side of said dielectric member, said first conductive layer having a slot across which said interrogation signal develops a first electrical field; a second conductive layer disposed on said second side of said dielectric member, said second conductive layer having a slot across which said interrogation signal develops a second electrical field, said first and second conductive layers being insulated from each other; and an integrated circuit semiconductor chip residing within said dielectric member, said integrated circuit semiconductor chip being electrically coupled to said first and second conductive layers. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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Specification