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Thermoelectric module having reduced spacing between semiconductor elements

  • US 5,434,744 A
  • Filed: 10/22/1993
  • Issued: 07/18/1995
  • Est. Priority Date: 10/22/1993
  • Status: Expired due to Term
First Claim
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1. An improved thermoelectric module comprising:

  • a first substrate having a surface bearing a first electrically conductive pattern;

    a second substrate having a surface opposing said first substrate surface and bearing a second electrically conductive pattern;

    an array of first and second type material elements between said surfaces of said first and second substrates, each first and second type material element having a first side contacting said first conductive pattern and a second side contacting said second electrically conductive pattern, said first and second conductive patterns arranged with respect to said array to form an electrical circuit of said first and second type material elements serially connected, said first and second type material elements alternating in said circuit, said array arranged in alternating rows of first and second type material elements, each row containing a single element type, each element in a row spaced apart from a neighboring element in said row by less than 0.010 inch;

    whereby said first and second type material elements can cover an increased fraction of the area of said surfaces of said first and second substrates to form an improved thermoelectric module.

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