Self-aligned channel stop for trench-isolated island

• US 5,436,189 A
• Filed: 08/13/1993
• Issued: 07/25/1995
• Est. Priority Date: 10/03/1989
• Status: Expired due to Term

• Current Assignee: Intersil Corporation (Renesas Electronics Corporation)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Beasom, James D.
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): DANG, TRUNG Q
• Application Number:
  US08/106,160
• Time in Patent Office: 711 Days
• Field of Search: 437/33, 437/67, 437/63, 437/64, 148/DIG. 50
• US Class Current: 438/430
• CPC Class Codes: H01L 21/762 Dielectric regions , e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
• CPC Class Codes: H01L 21/763 Polycrystalline semiconductor regions H01L21/76264 takes precedence
• CPC Class Codes: Y10S 148/05 Etch and refill

Abstract

A channel stop is self-aligned with a trench sidewall of a trench-isolated semiconductor architecture, so that there is no alignment tolerance between the stop and the trench wall. An initial masking layer, through which the trench pattern is to be formed in a semiconductor island layer, is used as a doping mask for introducing a channel stop dopant into a surface portion of the semiconductor layer where the trench is to be formed. The lateral diffusion of the dopant beneath the oxide and adjacent to the trench aperture defines the eventual size of the channel stop. The semiconductor layer is then anisotropically etched to form a trench to a prescribed depth, usually intersecting the underlying semiconductor substrate. Because the etch goes through only a portion of the channel stop diffusion, leaving that portion which has laterally diffused beneath-the oxide mask, the channel stop is self-aligned with the sidewall of the trench. The trench may be then oxidized and filled with polysilicon material to complete the trench isolation process. The width of the stop is controlled by lateral diffusion, which can be smaller than the width of a line defined by a mask, since that width is the minimum mask width plus twice the lateral diffusion of the layer defined by the mask.

Claims

1. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a semiconductor substrate having a first semiconductor portion of a first conductivity type, a second semiconductor portion of a second conductivity type, opposite to said first conductivity type, spaced apart from said first semiconductor portion by a separation surface portion therebetween, and a third semiconductor portion of said second conductivity type, formed beneath said first semiconductor portion;

(b) forming first and second semiconductor regions of said first and second conductivity types, respectively, in surface portions of said first and second semiconductor portions of said substrate, said first semiconductor region having an impurity concentration greater than that of said first semiconductor portion and said second semiconductor region having an impurity concentration greater than that of said second semiconductor portion and being spaced-apart from said third semiconductor portion of said second conductivity type;

(c) forming a trench through said separation surface portion of said semiconductor substrate, such that said trench intersects and extends through said first and second semiconductor portions, so that sidewalls of said trench touch said first and second semiconductor regions and said first and second portions of said substrate; and

(d) forming a layer of insulator material disposed along sidewalls of said trench.

2. A method according to claim 1, wherein step (a) further includes forming third and fourth semiconductor regions in said first and second portions of said semiconductor substrate, so as to be spaced apart from said first and second semiconductor regions formed in step (b).

3. A method according to claim 1, further including the step (f) of forming conductive material on said layer of insulator material in said trench.

4. A method according to claim 1, wherein step (c) comprises forming said trench such that said first semiconductor region has a first dimension which extends laterally in a surface portion of said first semiconductor portion of said substrate, and a second dimension, which extends vertically along a sidewall of said trench, such that the first dimension of said first semiconductor region is less than the second dimension of said first semiconductor region, and such that said second semiconductor region has a first dimension which extends laterally in a surface portion of said second semiconductor portion of said substrate, and a second dimension, which extends vertically along a sidewall of said trench, so that the first dimension of said second semiconductor region is less than the second dimension of said second semiconductor region.

5. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a semiconductor substrate having a first semiconductor layer containing a first portion of semiconductor material of a first conductivity type and a second portion of semiconductor material of a second conductivity type, opposite to said first conductivity type, and a second semiconductor layer containing a third portion of semiconductor material of said second conductivity type that overlies and touches said first portion of semiconductor material of said first layer, and a fourth portion of semiconductor material of said first conductivity type that overlies and touches said second portion of semiconductor material of said first layer;

(b) forming a first semiconductor region of said second conductivity type in a surface portion of said third portion of said second semiconductor layer, said first semiconductor region having an impurity concentration greater than that of said third portion of semiconductor material of said second semiconductor layer and being spaced-apart from said second portion of semiconductor material of said second conductivity type;

(c) forming a second semiconductor region of said first conductivity type in a surface portion of said fourth portion of said second semiconductor layer, said second semiconductor region having an impurity concentration greater than that of said fourth portion of semiconductor material of said second semiconductor layer;

(d) forming first and second trenches through said second semiconductor layer, so that sidewalls of said first and second trenches touch said first and second semiconductor regions, respectively, such that said first semiconductor region has a first dimension which extends laterally in said portion of said third semiconductor layer, and a second dimension which extends vertically along the sidewall of said first trench, such that said first dimension of said first semiconductor region is less than the second dimension of said first semiconductor region, and such that said second semiconductor region has a first dimension which extends laterally in said portion of said fourth semiconductor layer, and a second dimension which extends vertically along the sidewall of said second trench, such that said first dimension of said second semiconductor region is less than the second dimension of said second semiconductor region; and

(e) forming insulator material along sidewalls of said first and second trenches.

6. A method according to claim 5, further including the step (f) of forming conductive material on insulator material that has been formed along sidewalls of said first and second trenches in step (e).

7. A method according to claim 5, wherein said third portion of semiconductor material of said second conductivity type is spaced apart from said fourth portion of semiconductor material of said first conductivity type by a first separation portion through which said first trench is formed in step (d), and wherein a third semiconductor region of said second conductivity type is formed in another surface portion of said third portion of semiconductor material and extends into adjacent semiconductor material of said third portion of said second semiconductor layer, said third semiconductor region having an impurity concentration greater than that of said third portion of semiconductor material of said second semiconductor layer and being spaced-apart from said second portion of semiconductor material of said second conductivity type, such that said second trench formed in step (d) has its sidewall touching said third semiconductor region.

8. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a semiconductor substrate having a first semiconductor layer containing a first portion of semiconductor material of a first conductivity type and a second portion of semiconductor material of a second conductivity type, opposite to said first conductivity type, and a second semiconductor layer containing a third portion of semiconductor material of said second conductivity type that overlies and touches said first portion of semiconductor material of said first layer, and a fourth portion of semiconductor material of said first conductivity type that overlies and touches said second portion of semiconductor material of said first layer and is spaced apart from said third portion of semiconductor material of said second conductivity type;

(b) forming a first semiconductor region of said second conductivity type in a surface portion of said third portion of said second semiconductor layer, said first semiconductor region having an impurity concentration greater than that of said third portion of semiconductor material of said second semiconductor layer;

(c) forming a second semiconductor region of said first conductivity type in a surface portion of said fourth portion of said second semiconductor layer, said second semiconductor region having an impurity concentration greater than that of said fourth portion of semiconductor material of said second semiconductor layer;

(d) forming a third semiconductor region of said second conductivity type in another surface portion of said third portion of said semiconductor material of said semiconductor layer and extending into adjacent semiconductor material of said third portion of said semiconductor material of said second semiconductor layer, said third semiconductor region having an impurity concentration greater than that of said third portion of said semiconductor material of said second semiconductor layer, and such that said second portion of semiconductor material of said first semiconductor layer underlies and touches a prescribed region of said third portion of semiconductor material of said second semiconductor layer;

(e) forming first and second trenches through said second semiconductor layer to said first semiconductor layer, such that sidewalls of said first and second trenches touch said first and second semiconductor regions, respectively, and such that said second trench has its sidewall touch said third semiconductor region;

(f) forming insulator material along sidewalls of said first and second trenches; and

(g) forming an ohmic contact region of said second conductivity type in a further surface portion of said third portion of said second semiconductor layer.

9. A method according to claim 8, wherein step (e) comprises forming said first and second trenches such that said first semiconductor region has a first dimension which extends laterally in said first portion of said third portion of said second semiconductor layer, and a second dimension which extends vertically along the sidewall of said first trench, such that said first dimension of said first semiconductor region is less than the second dimension of said first semiconductor region, and such that said second semiconductor region has a first dimension which extends laterally in said second surface portion of said fourth portion of said second semiconductor layer, and a second dimension which extends vertically along the sidewall of said second trench, such that said first dimension of said second semiconductor region is less than the second dimension of said second semiconductor region.

10. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a semiconductor substrate having a first semiconductor layer of a first conductivity type, and a second semiconductor layer of a second conductivity type, opposite to said first conductivity type, formed on said first semiconductor layer and having a first surface;

(b) forming a first semiconductor region of said second conductivity type in a first surface position of said first surface of said second semiconductor layer surrounding and being spaced apart from a second surface portion of said first surface of said second semiconductor layer by a third surface portion of said first surface of said second semiconductor layer therebetween, while being spaced apart from said first semiconductor layer and having an impurity concentration greater than that of said second semiconductor layer;

(c) forming a trench through said first semiconductor region and said second semiconductor layer to said first semiconductor layer, so that said trench surrounds said second and third surface portions of said first surface of said second semiconductor layer, and has a sidewall touching said first semiconductor region, said trench dividing said first semiconductor region into a first semiconductor portion adjacent to said third surface portion of said first surface of said second semiconductor layer and into a second semiconductor portion, separated from said third surface portion of said first surface of said second semiconductor layer by said trench, such that said first semiconductor portion has a first dimension which extends laterally into said third surface portion of said first surface of said second semiconductor layer, and a second dimension which extends vertically along said sidewall of said trench, such that said first dimension is less than said second dimension;

(d) forming a first layer of insulator material along said sidewall of said trench and extending through said second semiconductor layer, and forming conductive material on said first layer of insulator material along said sidewall of said trench; and

(e) forming a second semiconductor region of said first conductivity type in said second surface portion of said first surface of said second semiconductor layer.

11. A method of manufacturing a semiconductor device comprising the steps of:

(a) providing a semiconductor substrate having a first semiconductor layer of a first conductivity type, and a second semiconductor layer of a second conductivity type, opposite to said first conductivity type, formed on said first semiconductor layer and having a first surface;

(b) forming a first semiconductor region of said second conductivity type in a first surface position of said first surface of said second semiconductor layer surrounding and being spaced apart from a second surface portion of said first surface of said second semiconductor layer by a third surface portion of said first surface of said second semiconductor layer therebetween, while being spaced apart from said first semiconductor layer and having an impurity concentration greater than that of said second semiconductor layer;

(c) forming a trench through said first semiconductor region and said second semiconductor layer to said first semiconductor layer, so that said trench surrounds said second and third surface portions of said first surface of said second semiconductor layer, and has a sidewall touching said first semiconductor region, said trench dividing said first semiconductor region into a first semiconductor portion adjacent to said third surface portion of said first surface of said second semiconductor layer and into a second semiconductor portion, separated from said third surface portion of said first surface of said second semiconductor layer by said trench, such that said first semiconductor portion has a first dimension which extends laterally into said third surface portion of said first surface of said second semiconductor layer, and a second dimension which extends vertically along said sidewall of said trench, such that said first dimension is less than said second dimension;

(d) forming a first layer of insulator material along said sidewall of said trench and extending through said second semiconductor layer; and

(e) forming a second semiconductor region of said first conductivity type in said second surface portion of said first surface of said second semiconductor layer; and

wherein

step (b) comprises selectively forming a masking layer on said first surface of said semiconductor layer, said masking layer having an aperture overlying and exposing only a portion of said first surface portion of said first surface of said semiconductor layer in which said first semiconductor region is to be formed in step (c), and introducing impurities of said second conductivity type through said masking layer aperture into said second semiconductor, so that said impurities diffuse horizontally along said third surface portion of said first surface of said second semiconductor layer beneath said masking layer and vertically into said second semiconductor layer, thereby forming said first semiconductor region of said second conductivity type in said first surface portion of said first surface of said second semiconductor layer, and wherein

step (c) comprises using said masking layer aperture to define a lateral extent of said trench through first semiconductor region and said second semiconductor layer to said first semiconductor layer, so that said sidewall of said trench touches that portion of said first semiconductor region beneath said masking layer.