Method and apparatus for isolating electronic boards from shock and thermal environments

• US 5,438,162 A
• Filed: 09/02/1993
• Issued: 08/01/1995
• Est. Priority Date: 09/10/1992
• Status: Expired due to Term

• Current Assignee: Alliedsignal Inc.
• Original Assignee: Alliedsignal Inc.
• Inventors: Thompson, Craig, Eakin, Lawrence L.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Horgan, Christopher
• Application Number:
  US08/115,862
• Time in Patent Office: 698 Days
• Field of Search: 174/52.1, 174/52.2, 174/52.4, 206/521, 206/521.15, 206/521.2, 206/523, 206/305, 206/328, 206/334, 206/811, 220/415, 220/453, 220/468, 220/452, 220/429, 220/469, 455/96, 455/98, 29/841, 29/832
• US Class Current: 174/524
• CPC Class Codes: H05K 5/021 specially adapted for data recorders, e.g. for flight recorders
• CPC Class Codes: H05K 5/0213 Venting apertures; Constructional details thereof
• CPC Class Codes: H05K 7/1417 having securing means for mounting boards, plates or wiring boards H05K7/1461 takes precedence
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

An apparatus for isolating electronic devices from mechanical shock and thermal environments utilizes a metal outer protective shell surrounding the electronic device to be protected. Interposed between the protective shell and the electronic device are a thermal insulating layer, a layer of phase change material and a layer of mechanical shock absorbent material.

Claims

1. Apparatus for isolating an electronic device from mechanical shock and thermal environments, comprising:

a layer of a rubber-like material surrounding said electronic device;

a mass of preformed wax-like material having a high heat of fusion for absorbing a substantial quantity of heat before rising above a critical temperature limit in direct contact with and surrounding said rubber-like material;

a heat insulating layer surrounding said mass of wax-like material; and

a metal shell surrounding said heat insulating layer.

2. The apparatus of claim 1, wherein:

said rubber-like material is a fluid that surrounds said electronic device and cures to form a resilient layer of shock resistant material for protecting said electronic device against mechanical shock forces.

3. The apparatus of claim 2, wherein:

said fluid is a silicone rubber-like material that cures in time to form a layer of rubber-like consistency.

4. The apparatus of claim 3, wherein:

said silicone rubber-like material has a non-adhesive property after curing so as to be readily peeled away from said electronic device.

5. The apparatus of claim 3, wherein:

said silicone rubber material is of a type that cures in approximately twenty-four hours after being applied to said electronic device.

6. The apparatus of claim 1, wherein:

said wax-like material is a pre-formed mass having a cavity formed therein.

7. The apparatus of claim 6, wherein:

said rubber-like material is contained in said cavity.

8. Apparatus for isolating a heat and mechanical shock sensitive device from heat and mechanical shock, comprising:

a resilient shock-absorbent structure supporting said device;

a heat sink formed by a preformed mass of material having high heat of fusion directly contacting and surrounding said device and shock-absorbent structure; and

a heat insulating and physical penetration resistant shell surrounding said heat sink.