Thermo-curable and ultraviolet-curable adhesive capable of high precision bonding
First Claim
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1. A photosensitive and heat-sensitive adhesive having a composition which comprises:
- component (A) comprising a vinylester of an urethanated bisphenol A epoxy resin;
component (B) comprising a partial vinylester of a cresol novolak epoxy resin;
component (C) comprising an acrylic reactive diluent;
component (D) comprising photopolymerization initiator; and
component (E) comprising an epoxy cure agent;
wherein the composition ratio range of said component (A);
said component (B);
said component (C) is 20-60;
20-60;
10-40 by weight percent based on the total weight of said components (A), (B) and (C).
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Abstract
An adhesive for use in bonding finely processed parts such as parts of ink jet recording head has a composition which essentially contains: (A) a vinylester compound of an urethanated epoxy resin; (B) a partial vinylester compound of a multi-functional epoxy resin; (C) an acrylic reactive diluent; (D) a photopolymerization initiator; and(E) an epoxy cure agent. This adhesive is curable by ultraviolet irradiation or by application of heat, and does not flow or spread into areas where bonding is not necessary, so that finely processed parts are bonded with a high degree of precision of the bonding pattern.
35 Citations
8 Claims
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1. A photosensitive and heat-sensitive adhesive having a composition which comprises:
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component (A) comprising a vinylester of an urethanated bisphenol A epoxy resin; component (B) comprising a partial vinylester of a cresol novolak epoxy resin; component (C) comprising an acrylic reactive diluent; component (D) comprising photopolymerization initiator; and component (E) comprising an epoxy cure agent; wherein the composition ratio range of said component (A);
said component (B);
said component (C) is 20-60;
20-60;
10-40 by weight percent based on the total weight of said components (A), (B) and (C). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification