Three-dimensional periodic dielectric structures having photonic bandgaps

• US 5,440,421 A
• Filed: 05/10/1994
• Issued: 08/08/1995
• Est. Priority Date: 05/10/1994
• Status: Expired due to Fees

• Current Assignee: Massachusetts Institute of Technology
• Original Assignee: Massachusetts Institute of Technology
• Inventors: Meade, Robert D., Fan, Shanhui, Joannopoulos, John D., Villeneuve, Pierre R.
• Primary Examiner(s): Hellner, Mark
• Application Number:
  US08/240,916
• Time in Patent Office: 455 Days
• Field of Search: 359/344, 437/15, 437/235, 437/236, 437/915, 257/16, 257/17, 257/14, 257/21
• US Class Current: 359/245
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G02B 6/1225 comprising photonic band-gap structures or photonic lattices
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces

Abstract

A periodic dielectric structure and method of fabricating same, the structure having a three-dimensional photonic bandgap. The structure includes a plurality of layers, each layer having a stratum of a first material having a first dielectric constant and a plurality of parallel grooves along a first axis lying in the plane of the layer, the grooves including a second material having a second dielectric constant; and a plurality of parallel channels formed through the plurality of layers in a second axis orthogonal to the plane of the layers, the channels being adapted to comprise a third material having a third dielectric constant, thereby resulting in the structure having three-dimensional periodicity. In preferred embodiments, the second and third materials include air.

Claims

1. A method of fabricating a periodic dielectric structure having a three-dimensional photonic bandgap, said method comprising the steps of:

(a) providing a substrate;

(b) applying a layer of a first material having a first dielectric constant on said substrate;

(c) forming a plurality of parallel grooves along a first axis lying in the plane of said layer;

(d) filling said plurality of grooves with a second material having a second dielectric constant;

(e) applying a further layer of said first material to overlie the previous layer of first material and filled grooves;

(f) repeating steps (c)-(e) a predetermined number of times to form a multi-layered structure; and

(g) forming a plurality of parallel channels through said multi-layered structure in a second axis orthogonal to the plane of the layers, said channels being adapted to comprise a third material having a third dielectric constant, thereby resulting in said structure having three-dimensional periodicity.

2. The method of claim 1, wherein step (g) further comprises the step of utilizing air as said third material.

3. The method of claim 1, wherein steps (b) and (e) further comprise the step of depositing silicon as said first material.

4. The method of claim 3, wherein step (d) further comprises the step of depositing silicon dioxide as said second material.

5. The method of claim 4, wherein said substrate comprises silicon.

6. The method of claim 1, wherein steps (b) and (e) further comprise the step of depositing gallium arsenide as said first material.

7. The method of claim 6, wherein step (d) further comprises the step of depositing aluminum gallium arsenide as said second material.

8. The method of claim 7, wherein said substrate comprises gallium arsenide.

9. The method of claim 1 further comprising the step of removing said second material from said structure.

10. The method of claim 1, wherein said further layers of said first material comprise a height h, and said grooves filled with said second material comprise a depth d and width w, wherein d is equal to or greater than h, such that said grooves extend into a previous layer of said first material.

11. The method of claim 10, wherein said grooves associated with any one layer of first material are separated by a distance a, and grooves associated with previous or subsequent layers of said first material are translated by a distance of a/2.

12. The method of claim 11, wherein said channels are separated along said first axis by a distance b, and are separated by said distance b along a third axis perpendicular to each of said first and second axes.

13. The method of claim 1, wherein said structure is fabricated at submicron lengthscales.

14. The method of claim 13, wherein said bandgap is fabricated to be in the range from 14% to 23% of the midgap frequency.

15. A periodic dielectric structure having a three-dimensional photonic bandgap, comprising:

a plurality of layers, each layer including a stratum of a first material having a first dielectric constant and a plurality of parallel grooves along a first axis in the plane of said layer, said grooves comprising a second material having a second dielectric constant; and

a plurality of parallel channels formed through said plurality of layers in a second axis orthogonal to the plane of the layers, said channels being adapted to comprise a third material having a third dielectric constant, thereby resulting in said structure having three-dimensional periodicity.

16. The structure of claim 15, wherein said third material comprises air.

17. The structure of claim 16, wherein said second material comprises air.

18. The structure of claim 16, wherein said first material comprises silicon and said second material comprises silicon dioxide.

19. The structure of claim 16, wherein said first material comprises gallium arsenide and said second material comprises aluminum gallium arsenide.

20. A method of fabricating a periodic dielectric structure having a three-dimensional photonic bandgap, said method comprising the steps of:

forming a plurality of layers, each layer including a stratum of a first material having a first dielectric constant and a plurality of parallel grooves along a first axis lying in the plane of said layer, said grooves comprising a second material having a second dielectric constant; and

forming a plurality of parallel channels through said plurality of layers in a second axis orthogonal to the plane of the layers, said channels being adapted to comprise a third material having a third dielectric constant, thereby resulting in said structure having three-dimensional periodicity.