Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed

• US 5,444,637 A
• Filed: 09/28/1993
• Issued: 08/22/1995
• Est. Priority Date: 09/28/1993
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Smesny, Greg A., Conboy, Michael R.
• Primary Examiner(s): Voeltz, Emanuel T.
• Assistant Examiner(s): MILLER, CRAIG S
• Application Number:
  US08/127,941
• Time in Patent Office: 693 Days
• Field of Search: 364/468, 364/556, 364/557, 364/561, 437/8, 257/499
• US Class Current: 702/127
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A semiconductor wafer is provided for sensing and recording processing conditions to which the wafer is exposed. The wafer can also write the recorded processing conditions to an external output device connectable to the wafer. The wafer includes a plurality of regions spaced across the wafer, and at least one sensor placed within each region. The sensor can sense a single processing condition such as, e.g., pressure, temperature, fluidic flow rate, or gas composition. If more than one processing condition is to be measured, then more than one sensor can be placed in each region to provide a sensed reading across the entire wafer surface necessary for gradient measurements. The wafer further includes signal acquisition/conditioning circuit which receives analog signals from each of the sensors placed upon the wafer and converts the analog signals to corresponding digital signals. Digital signals can then be stored within and processed by a processor also formed within the wafer. The semiconductor wafer further includes input/output probe pads which receive external input to the wafer circuitry and output stored information from the circuitry.

Claims

1. A semiconductor wafer for sensing and recording processing conditions to which the wafer is exposed, comprising:

a semiconductor substrate having a plurality of regions spaced upon one surface of said substrate;

at least one sensor lithography formed within each of said regions for producing during use an analog signal responsive to a processing condition;

a signal acquisition/conditioning circuit coupled to an output of said sensor and lithography formed upon said substrate for converting said analog signals to digital signals;

a microprocessor system lithography formed upon said substrate having a stored instruction set, said system comprises;

an input port coupled to an output of said acquisition/conditioning circuit for receiving said digital signals; and

a random access memory having an addressable data bus connected to said input port for recording said digital signal during times in which a select said stored instruction set is executed.

2. The semiconductor wafer as recited in claim 1, wherein said plurality of regions are spaced substantially equi-distant from each other across said substrate with said acquisition/conditioning circuit and said microprocessor system arranged between select said regions.

3. The semiconductor wafer as recited in claim 1, further comprising a power source formed within said substrate.

4. The semiconductor wafer as recited in claim 1, wherein said signal acquisition/conditioning circuit comprises an amplifier circuit, a sample and hold circuit, and an analog-to-digital converter.

5. The semiconductor wafer as recited in claim 1, wherein said signal acquisition/conditioning circuit comprises a multiplex circuit coupled to receive the analog signal from a plurality of sensors and further adapted for producing a serial time-division multiplex output corresponding to the analog signal from each said sensor.

6. The semiconductor wafer as recited in claim 1, wherein said signal acquisition/conditioning circuit and said microprocessor system are synchronously controlled from an external control circuit, and said external control circuit is coupled to, and can be accessed through, an input probe pad arranged upon said semiconductor substrate, wherein said input probe pad is operably connected to an external input device during times in which said external control circuit is accessed through said input probe pad.

7. The semiconductor wafer as recited in claim 6, wherein said external input device comprises a keyboard.

8. The semiconductor wafer as recited in claim 1, further comprising an output port coupled to said data bus for receiving said digital signals upon said data bus during times in which a select said stored instruction set is executed.

9. The semiconductor wafer as recited in claim 8, wherein said output port comprises an output probe pad operable connected during use to an external output device.

10. The semiconductor wafer as recited in claim 9, wherein said external output device comprises an electronic display.

11. The semiconductor wafer as recited in claim 1, wherein said sensor comprises a light emitting diode and a photodiode formed within said substrate and spaced apart from each other a select distance, said light emitting diode produces during use a light beam capable of reflection from a remote target and said photodiode receives during use said reflected light beam during times in which said remote target is a calibrated distance from said semiconductor substrate.

12. A semiconductor wafer for sensing, recording and retrieving processing conditions to which the wafer is exposed, comprising:

a semiconductor substrate having a plurality of regions spaced upon one surface of said substrate;

a plurality of sensors lithography formed within each of said regions for producing during use a plurality of analog signals responsive to a plurality of processing conditions existing across substantially the entire said substrate;

a multiplex circuit coupled to receive said plurality of analog signals from said plurality of sensors;

a sample and hold circuit coupled to serially receive multiplex output from said multiplex circuit and temporarily store said multiplex output;

an analog-to-digital converter coupled to the output of said sample and hold circuit for producing a plurality of digital signals corresponding to respective said plurality of analog signal;

a microprocessor system lithography formed upon said substrate having a programmable read only memory for storing an instruction set, said system comprises;

an input port coupled to an output of said analog-to-digital converter for receiving said digital signals;

a random access memory having an addressable data bus connected to said input port for recording said digital signals within said random access memory during times in which a select said stored instruction set is executed; and

an output probe pad arranged upon said semiconductor substrate capable of electrical connection to an external output device for retrieving said digital signals from said random access memory during times in which a select said stored instruction set is executed.

13. The semiconductor wafer as recited in claim 12, wherein said multiplex circuit, said sample and hold circuit, said analog-to-digital converter and said microprocessor system are synchronously controlled from an external control circuit, and said external control circuit is coupled to, and can be accessed through an input probe pad arranged upon said semiconductor substrate, wherein said input probe pad is operably connected to an external input device during times in which said external control circuit is accessed through said input probe pad.

14. The semiconductor wafer as recited in claim 12, wherein said external output device comprises an electronic display.

15. The semiconductor wafer as recited in claim 13, wherein said external input device comprises a keyboard.

16. The semiconductor wafer as recited in claim 12, further comprising a rechargeable power supply, said battery is formed within said substrate and is connected to said sensors, said multiplex circuit, said sample and hold circuit, said analog-to-digital circuit and said microprocessor system.

17. The semiconductor wafer as recited in claim 12, wherein a pair of said plurality of said sensors comprises a light emitting diode and a photodiode formed within said substrate and spaced apart from each other a select distance, said light emitting diode produces during use a light beam capable of reflection from a remote target and said photodiode receives during use said reflected light beam during times in which said remote target is a calibrated distance from said semiconductor substrate.

19. The method as recited in claim 17, further comprising:

providing a signal acquisition/conditioning circuit and a microprocessor system upon said substrate;

providing a conductive input probe pad upon said substrate, said input probe pad is connected to an input of said acquisition/conditioning circuit and said microprocessor system; and

sending an instruction set, and programmable control signals to said acquisition/conditioning circuit and said microprocessor system from an input device connectable to said input probe pad.

20. The method as recited in claim 17, further comprising:

providing a decoder circuit and an output probe pad connected to said data bus;

addressing select said array of memory cells and sending a digital information signal representative of information stored within said cells upon said data bus; and

decoding said digital information signal and forwarding said decoded digital information signal to an output device connectable to said output probe pad.

18. A method for sensing, recording and retrieving processing conditions into and from a semiconductor wafer, comprising the steps of:

providing a semiconductor substrate having a plurality of sensors spaced upon said substrate;

sensing a plurality of processing conditions placed upon said semiconductor substrate;

assigning an analog signal to each of said plurality of processing conditions;

multiplexing each analog signal into a stream of analog signals;

converting said stream of analog signals into a plurality of digital signals; and

encoding each of said plurality of digital signals and placing said encoded digital signals upon a data bus connected to an array of memory cells.