Combustion device

  • US 5,445,522 A
  • Filed: 04/26/1993
  • Issued: 08/29/1995
  • Est. Priority Date: 04/26/1993
  • Status: Expired due to Term
First Claim
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1. An oxidation furnace for treating semiconductor wafers, said furnace having a combustion device for feeding hydrogen gas and oxygen gas, while heating the same, through a hydrogen gas feed pipe and an oxygen gas feed pipe and combusting the gases to generate water vapor, said combustion device comprising:

  • an elongate combustion vessel having a first end portion and a second end portion located opposite to said first end portion;

    a hydrogen gas injection nozzle located centrally in said first end portion and provided on a forward end of said hydrogen gas feed pipe for axially feeding hydrogen gas into said first end of said elongate combustion vessel, said hydrogen injection nozzle having an injection port;

    a plurality of oxygen gas injection nozzles each having an injection port, said oxygen gas injection nozzles being located concentrically around said hydrogen injection nozzle, said oxygen gas injection nozzles being provided on a forward end of said oxygen gas feed pipe for axially feeding oxygen gas into said first end portion of said elongate combustion vessel,said oxygen gas injection ports being located further forward toward said second end portion in said elongate combustion vessel beyond said injection port of said hydrogen gas injection nozzle,said combustion vessel having a water vapor outlet located at said second end of said elongate combustion vessel.

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