Apparatus for producing semiconductor wafers

• US 5,447,596 A
• Filed: 03/08/1994
• Issued: 09/05/1995
• Est. Priority Date: 03/10/1993
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Hayase, Iwao
• Primary Examiner(s): Osele, Mark A.
• Application Number:
  US08/207,419
• Time in Patent Office: 546 Days
• Field of Search: 156/344, 156/584, 269/21, 279/3
• US Class Current: 156/750
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: Y10S 156/941 Means for delaminating semiconductive product
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/1111 Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
• CPC Class Codes: Y10T 156/19 Delaminating means
• CPC Class Codes: Y10T 279/11 Vacuum

Abstract

An apparatus for separating a wafer from a support plate, to which the wafer is bonded with a thermally softened adhesive, includes an upper plate having opposite upper and lower surfaces and a plurality of holes having apertures at the lower surface through which air is evacuated to hold the support plate to the lower surface; a lower plate having opposite upper and lower surfaces and a plurality of holes having apertures at the upper surface through which air is evacuated to hold the wafer to the upper surface; a heater for softening the thermally softened adhesive embedded in at least one of the upper and lower plates; a robot arm for moving the upper plate in vertical and horizontal directions; and a shaft for rotatably connecting the upper plate to the robot arm. In operation, after the adhesive connecting the wafer and the support plate is softened by the heater, the robot arm moves the upper plate upward while rotating or turning the upper plate, whereby the support plate is separated from the wafer. Therefore, the wafer is prevented from cracking and breaking, whereby the production yield is increased, resulting in a reduction in the cost of the device.

Claims

1. An apparatus for separating a wafer from a support plate attached to the wafer with a thermally softened adhesive, the wafer and support plate constituting a work having opposite first and second surfaces, the apparatus comprising:

an upper plate having opposite upper and lower surfaces and a plurality of holes at the lower surface through which air is evacuated to hold the first surface of the work to the lower surface;

a lower plate having opposite upper and lower surfaces and a plurality of holes at the upper surface through which air is evacuated to hold the second surface of the work to the upper surface;

a heater for softening the thermally softened adhesive embedded in at least one of the upper and lower plates;

a robot arm for moving the upper plate in vertical and horizontal directions; and

a shaft rotatably connecting the upper plate to the robot arm.

2. The apparatus of claim 1 comprising means for absorbing shock generated when the work held against the lower surface of the upper plate is put in contact against the upper surface of the lower plate, said shock absorbing means being disposed beneath the lower plate.

3. The apparatus of claim 2 wherein said shock absorbing means comprises:

a plurality of rods fixed to the lower surface of the lower plate at right angles;

a plurality of cylindrical holders disposed beneath the lower plate in which respective rods are movably inserted in a vertical direction; and

a plurality of springs disposed between the lower plate and the respective cylindrical holders.

4. The apparatus of claim 1 comprising means for holding the support plate to the lower surface of the upper plate by pressing the support plate against the lower surface of the upper plate, said means being disposed at a periphery of the upper plate.

5. The apparatus of claim 4 wherein said support plate holding means comprises:

at least two air cylinders fixed to the periphery of the upper plate; and

claws connected to the respective cylinders for holding the peripheral portion of the support plate on the lower surface of the upper plate.

6. The apparatus of claim 1 comprising means for pulling the lower plate downward in the vertical direction disposed on the lower surface of the lower plate.

7. The apparatus of claim 6 wherein said lower plate pulling means is a weight fixed to the lower surface of the lower plate.

8. The apparatus of claim 6 wherein said lower plate pulling means is an air cylinder connected to the lower surface of the lower plate.

9. The apparatus of claim 6 wherein said lower plate pulling means comprises:

a plurality of rods fixed to the lower surface of the lower plate at right angles;

a plurality of cylindrical holders disposed beneath the lower plate, in which the respective rods are inserted movably in vertical direction; and

a plurality of springs disposed between the lower plate and the respective cylindrical holders, each spring having opposite ends respectively fixed to the lower plate and the cylindrical holder.

10. The apparatus of claim 1 wherein said upper plate has a convex lower surface.

11. The apparatus of claim 1 wherein said upper plate comprises a first layer having a surface for contacting a work and a second layer disposed on the first layer, and the first layer has a thermal expansion coefficient larger than that of the second layer.

12. The apparatus of claim 11 wherein the upper plate comprising the first and second layers is divided into a plurality of parts having the same width in a direction perpendicular to the upper plate, and a heat insulating material is interposed between the adjacent parts.

13. The apparatus of claim 1 wherein said upper plate comprises a shape memory alloy which deforms when heated so that the upper plate has a convex lower surface.

14. The apparatus of claim 1 wherein said upper plate comprises a central disc part fixed to the shaft, and a peripheral annular part surrounding the disc part and moving in the vertical direction.

15. The apparatus of claim 1 comprising a nozzle for applying a solution that dissolves the thermally softened adhesive to the wafer and the support plate.

16. The apparatus of claim 1 comprising a container containing the apparatus and filled with a solution that dissolves the thermally softened adhesive.

17. The apparatus of claim 16 wherein said container is hermetically sealed for applying pressure to the solution in the container.

18. The apparatus of claim 16 comprising a heater for heating the solution.

19. The apparatus of claim 17 comprising a heater for heating the solution.