Method of forming semiconducting materials and barriers using a multiple chamber arrangement

  • US 5,470,784 A
  • Filed: 09/23/1992
  • Issued: 11/28/1995
  • Est. Priority Date: 12/05/1977
  • Status: Expired due to Term
First Claim
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1. A process for glow discharge deposition in an apparatus comprising, a first deposition chamber adapted to be evacuated, first gas introducing means for introducing a first gaseous material into said first deposition chamber, first electrode means disposed in said first deposition chamber, a second deposition chamber adapted to be evacuated, second gas introducing means for introducing a second gaseous material into said second deposition chamber, second electrode means disposed in said second deposition chamber, restricting means for restricting the flow of at least one of said gaseous materials from one of said deposition chambers into the other one of said deposition chamber, said restricting means being disposed between said first deposition chamber and said second deposition chamber, and transporting means for transporting said substrate from one of said deposition chambers to the other one of said deposition chambers through said restricting means, said process comprising the steps of:

  • disposing said substrate in said first deposition chamber;

    introducing said first gaseous material in said first deposition chamber and applying a first electric field to a first region in said first deposition chamber by said first electrode so as to generate a first glow discharge, whereby a first layer is deposited on said substrate;

    transporting said substrate on which said first layer is deposited from said first deposition chamber to said second deposition chamber through said restricting means, while each interior of said deposition chambers is shielded from an external atmosphere;

    disposing said substrate on which said first layer is deposited in said second deposition chamber; and

    introducing said second gaseous material in said second deposition chamber and applying a second electric field to a second region in said second deposition chamber by said second electrode so as to generate a second glow discharge, whereby a second layer is deposited on said first layer.

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