Printed-circuit substrate and its connecting method

• US 5,478,006 A
• Filed: 05/20/1994
• Issued: 12/26/1995
• Est. Priority Date: 05/24/1993
• Status: Expired due to Term

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Taguchi, Toshimichi
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US08/247,107
• Time in Patent Office: 585 Days
• Field of Search: 228/175, 228/180.1, 228/180.21, 228/106, 228/214, 29/841, 29/855
• US Class Current: 228/180.21
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0397 Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/10136 Liquid Crystal display [LCD]
• CPC Class Codes: H05K 2201/10681 Tape Carrier Package [TCP]; Flexible sheet connector
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: H05K 3/363 by soldering

Abstract

A printed-circuit substrate is provided with: a film-shaped support base having an electrical insulating property and elasticity, which includes a resin mold section for supporting an IC; a plurality of foil-shaped electrodes which are connected to the IC and supported by the support base in such a manner as to extend toward the periphery of the support base; and an exposed portion which is provided by removing the support base in the direction orthogonal to the foil-shaped electrodes over an entire area of the support base between the IC chip and the periphery thereof so as to expose one portion of each foil-shaped electrode. In the case of connecting the foil-shaped electrodes to electrodes of a printed-circuit substrate by means of soldering, the tips of the foil-shaped electrodes are soldered to the respective electrodes by applying heat and pressure to a part of the support base located on the tip-side of the exposed portions of the foil-shaped electrodes. This arrangement makes it possible to improve the pliability of the exposed portion; therefore, even if the support base is miniaturized to have a thin width by shortening the exposed portion, the reliability of the connecting structure is improved between the tips of the foil-shaped electrodes and the electrodes.

Claims

1. A connecting method for a printed-circuit substrate, wherein the printed-circuit substrate includes film-shaped first and second support bases having an electrical insulating property and elasticity;

a resin mold section for securely fixing an integrated circuit supported on the first support base; and

a plurality of foil-shaped electric conductors that are connected to the integrated circuit and installed on the first and the second support bases such that the first and the second support bases are connected to each other by the foil-shaped electric conductors, comprising the step of;

soldering the foil-shaped electric conductors by applying heat and pressure to the second support base.

2. The connecting method for the printed-circuit substrate as defined in claim 1, wherein the first support base has an opening wherein the base ends of the foil-shaped electric conductors are exposed and the integrated circuit is supported by the resin mold section.

3. The connecting method for the printed-circuit substrate as defined in claim 1, wherein the first and the second support bases are formed into thin-width rectangular shapes, the second support base being disposed with respect to the first support base such that the longer side of the second support base are virtually parallel to the longer side of the first support base.

4. The connecting method for the printed-circuit substrate as defined in claim 3, wherein the foil-shaped electric conductors connecting the first and the second support bases are arranged virtually in parallel with one another.

5. The connecting method for the printed-circuit substrate as defined in claim 3, wherein the foil-shaped electric conductors include those of a type which extend from the base ends, cross one of the longer sides of the second support base facing the first support base, and reach a peripheral edge corresponding to the other longer side.

6. The connecting method for the printed-circuit substrate as defined in claim 5, wherein the foil-shaped electric conductors are parallel to one another at the peripheral edge.

7. The connecting method for the printed-circuit substrate as defined in claim 1, further comprising the preliminary step of:

prior to said step, placing the second support base so that it is pressed and heated from a surface opposite to the surface whereon the foil-shaped electric conductors are supported.

8. The connecting method for the printed-circuit substrate as defined in claim 1, further comprising the steps of:

providing a pressing and heating means for pressing and heating the second support base; and

placing a film member for preventing contaminants from adhering to the pressing and heating means between the pressing and heating means and the second support base, upon pressing and heating the second support base by the use of the pressing and heating means.

9. The connecting method for the printed-circuit substrate as defined in claim 8, further comprising the post-step of:

updating the film member after said process.