Method for mounting integrated circuits onto printed circuit boards and testing

• US 5,479,694 A
• Filed: 04/13/1993
• Issued: 01/02/1996
• Est. Priority Date: 04/13/1993
• Status: Expired due to Term

• Current Assignee: Micron Semiconductor, Inc. (Micron Technology, Inc.)
• Original Assignee: Micron Technology, Inc.
• Inventors: Baldwin, Donald D.
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US08/048,129
• Time in Patent Office: 994 Days
• Field of Search: 29/593, 29/840, 29/741, 29/719, 228/180.21, 228/212, 228/6.2, 324/754
• US Class Current: 29/593
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 3/087 Soldering or brazing jigs, fixtures or clamping means
• CPC Class Codes: B23K 31/12 relating to investigating the properties, e.g. the weldability, of materials
• CPC Class Codes: B23Q 3/1546 using permanent magnets
• CPC Class Codes: G01R 1/04 Housings; Supporting members; Arrangements of terminals
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/104 Using magnetic force, e.g. to align particles or for a temporary connection during processing
• CPC Class Codes: H05K 2203/1394 Covering open PTHs, e.g. by dry film resist or by metal disc
• CPC Class Codes: H05K 2203/162 Testing a finished product, e.g. heat cycle testing of solder joints patterns for electrical inspection or testing H05K1/0268
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/53083 : including means to apply magnetic force directly to position or hold work
• CPC Class Codes: Y10T 29/53183 : Multilead component
• CPC Class Codes: Y10T 29/53196 : Means to apply magnetic force directly to position or hold work part

Abstract

An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

Claims

1. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB), the PCB having a plurality of bonding sites provided thereon, the IC device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the IC device is mounted to the PCB, the method comprising the following steps:

providing a PCB having an upper surface;

providing magnetic material within the IC device;

inducing a magnetic field of a selected strength at the surface of the PCB to hold the IC device onto the PCB in such a manner that the conductive portions of the IC device are in alignment with the corresponding bonding sites;

testing the PCB and IC device while the IC device is being held onto the PCB by the magnetic field; and

after said testing, soldering the conductive bonding portions to the corresponding bonding sites of the PCB while the IC device is held onto the PCB by the magnetic field.

2. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 1 wherein:

the IC device comprises a semiconductor integrated circuit chip having a plurality of conductive bonding pads which form the conductive bonding portions; and

the method further comprising providing a layer of magnetic material within the semiconductor integrated circuit chip.

3. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 1 wherein:

the IC device comprises an IC package consisting of a semiconductor integrated circuit chip encapsulated in a casing and a lead frame electrically coupled to the semiconductor integrated circuit chip, the lead frame having a plurality of conductive leads which form the conductive bonding portions; and

the process further comprising forming the lead frame of a magnetic material.

4. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 1 wherein the magnetic material is selected from a group consisting of iron, nickel, and cobalt.

5. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB), the PCB having a plurality of bonding sites provided thereon, the IC device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the IC device is mounted to the PCB, the method comprising the following steps:

providing a PCB having an upper surface;

providing magnetic material within the IC device;

moving the IC device to the PCB;

aligning the conductive portions of the IC device with the corresponding bonding sites of the PCB;

placing the conductive portions in contact with the corresponding bonding sites;

inducing a magnetic field of a selected strength at the surface of the PCB to hold the IC device onto the PCB;

testing the PCB and IC device while the IC device is being held onto the PCB by the magnetic field; and

after said testing, soldering the conductive portions to the corresponding bonding sites of the PCB while the IC device is held onto the PCB by the magnetic field.

6. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 5 wherein:

the IC device comprises a semiconductor integrated circuit chip having a plurality of bonding pads which form the conductive bonding portions; and

the method further comprising providing a layer of magnetic material within the semiconductor integrated circuit chip.

7. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 5 wherein:

the IC device comprises an IC package consisting of a semiconductor integrated circuit chip encapsulated in a casing and a lead frame electrically coupled to the semiconductor integrated circuit chip, the lead frame having a plurality of conductive leads which form the conductive bonding portions; and

the process further comprising forming the lead frame of a magnetic material.

8. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 5 further comprising:

moving the IC device using a transfer mechanism having a handling instrument, the handling instrument having a surface;

creating a magnetic field to attract the IC device to the surface of the handling instrument;

maintaining the magnetic field to transfer the IC device to the PCB and to align the conductive portions with the bonding sites; and

ceasing to create the magnetic field after the conductive portions are aligned with the bonding sites.

9. A method for mounting an integrated circuit (IC) device onto a printed circuit board (PCB) according to claim 5 further comprising:

providing a layer of magnetic material in the PCB;

moving the IC device using a transfer mechanism having a handling instrument, the handling instrument having a surface;

creating a magnetic field to attract the IC device to the surface of the handling instrument;

maintaining the magnetic field to transfer the IC device to the PCB and to align the conductive portions with the bonding sites;

ceasing to create the magnetic field after the conductive portions are aligned with the bonding sites; and

magnetically charging the PCB layer to attract the magnetic material in the IC device and to hold the IC device onto the PCB.