Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent

• US 5,480,834 A
• Filed: 12/13/1993
• Issued: 01/02/1996
• Est. Priority Date: 12/13/1993
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Communications, Inc. (Micron Technology, Inc.)
• Inventors: Tuttle, Mark E., Lake, Rickie C.
• Primary Examiner(s): Fourson, George
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US08/166,747
• Time in Patent Office: 750 Days
• Field of Search: 437/183, 228/180.22, 257/737, 257/738, 257/746, 257/778, 257/780, 257/783
• US Class Current: 438/614
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10984 : Component carrying a connection agent, e.g. solder, adhesive soldering leadless components having an array of bottom contacts H05K3/3436; BGA components H05K2201/10734
• CPC Class Codes: H05K 3/321 : by conductive adhesives

Abstract

A process for manufacturing a low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed during the fabrication of the bonding interconnect.

Claims

1. A method of forming an electrical bonding interconnect to a substrate comprising the following steps:

providing an electrically conductive metal contact area on a substrate;

exposing the metal contact area to conditions effective to reactively form an electrically resistive metal oxide material from the metal;

applying an electrically conductive epoxy over the electrically resistive oxide material, the epoxy comprising a reducing agent effective to reduce the metal oxide back to conductive metal;

reducing the metal oxide back to conductive metal using the reducing agent present in the conductive epoxy; and

curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.

2. A method of forming an electrical bonding interconnect to a substrate comprising the following steps:

providing an electrically conductive metal contact area on a substrate;

exposing the metal contact area to conditions effective to reactively form an electrically resistive metal oxide material from the metal;

applying an electrically conductive epoxy over the electrically resistive oxide material, the conductive epoxy comprising a resin component and a hardener component, the hardener component comprising a reducing agent effective to reduce the metal oxide back to conductive metal;

reducing the metal oxide back to conductive metal using the reducing agent present in the hardener component of the conductive epoxy; and

curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.

3. A method of forming an electrical bonding interconnect to a substrate comprising the following steps:

providing a copper metal contact area on a substrate;

exposing the copper contact area to conditions effective to reactively form an electrically resistive copper oxide from the copper;

applying an electrically conductive epoxy over the electrically resistive oxide material, the epoxy comprising at least one of an alkoxylated polyalkyl amine or ethylene diamine;

reducing the copper oxide back to conductive copper metal using the at least one of the alkoxylated polyalkyl amine or ethylene diamine present in the conductive epoxy; and

curing the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.