Method and apparatus for filling a ball grid array

  • US 5,499,487 A
  • Filed: 09/14/1994
  • Issued: 03/19/1996
  • Est. Priority Date: 09/14/1994
  • Status: Expired due to Term
First Claim
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1. Apparatus for placing solder balls in a ball grid array, said apparatus comprising a wheel having an inner and an outer face, said wheel being rotatable about a horizontal axis, means for attaching a ball grid array to the inner face of said wheel, means for attaching a tooling fixture to the outer face of said wheel in a position corresponding to that of said ball grid array, means for forming a reservoir of solder balls at the bottom of said wheel, means for controllably rotating said wheel to move said tooling fixture through said reservoir in a manner to fill recesses in said fixture with solder balls and to remove from the surface of said array any excess solder balls which are not occupying recesses, said inner and outer faces being separated a distance to permit said tooling fixture to engage solder balls in said reservoir while said ball grid array does not engage said solder balls.

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