Method and apparatus for filling a ball grid array

• US 5,499,487 A
• Filed: 09/14/1994
• Issued: 03/19/1996
• Est. Priority Date: 09/14/1994
• Status: Expired due to Term

• Current Assignee: On Target Systems & Services Incorporated
• Original Assignee: Vanguard Automation, Inc. (11172239 Canada, Inc.)
• Inventors: McGill, Scott D.
• Primary Examiner(s): Coan, James F.
• Application Number:
  US08/306,144
• Time in Patent Office: 552 Days
• Field of Search: 53/473, 53/475, 53/246, 53/251, 53/250, 53/249, 53/263, 53/247, 53/244, 53/255, 53/235, 53/539
• US Class Current: 53/473
• CPC Class Codes: B65B 5/068 in trays B65B5/061 - B65B5/065 take precedence

Abstract

The reliable population of a ball grid array is achieved by attaching the array to the inner face of a wheel which is rotatable about a central axis. A tooling fixture is attached to the outer face of the wheel. Each of the ball grid array and the tooling fixture has a face with recesses and the faces face one another. The wheel moves the tooling fixture into a reservoir of solder balls to populate the recesses in the tooling fixture and the solder balls are dropped into the corresponding recesses of the ball grid array when the wheel rotates to a position where the recesses in the ball grid array are beneath the recesses in the tooling fixture. The array and the fixture are spaced apart initially so that the rotation of the wheel moves only the fixture through the reservoir ensuring that all recesses in the fixture are filled and that all solder balls not occupying recesses are removed from the surface of the fixture by the force of gravity as the wheel turns. The array and the fixture are moved together for the transfer of the solder balls to the ball grid array.

Claims

1. Apparatus for placing solder balls in a ball grid array, said apparatus comprising a wheel having an inner and an outer face, said wheel being rotatable about a horizontal axis, means for attaching a ball grid array to the inner face of said wheel, means for attaching a tooling fixture to the outer face of said wheel in a position corresponding to that of said ball grid array, means for forming a reservoir of solder balls at the bottom of said wheel, means for controllably rotating said wheel to move said tooling fixture through said reservoir in a manner to fill recesses in said fixture with solder balls and to remove from the surface of said array any excess solder balls which are not occupying recesses, said inner and outer faces being separated a distance to permit said tooling fixture to engage solder balls in said reservoir while said ball grid array does not engage said solder balls.

2. Apparatus as in claim 1 wherein said means for attaching comprises means for attaching a ball grid array strip.

3. Apparatus as in claim 2 wherein said apparatus is cylindrical in geometry and is rotatable along the central axis of the cylinder.

4. Apparatus as in claim 2 wherein said means for attaching comprises means for attaching more than one ball grid array strip to said inner surface of said wheel at spaced apart positions on said surface.

5. A method for filling a ball grid array with solder balls, said method comprising the steps of placing a ball grid array on the inner face of a wheel having an inner and an outer face and being rotatable about a horizontal axis, placing a tooling fixture in a corresponding position on the outer face of said wheel, placing at the bottom of said wheel a reservoir of solder balls, and rotating said wheel to move said tooling fixture through said reservoir in a manner to avoid the movement of said ball grid array through said reservoir.

6. Apparatus for filling a ball grid array with solder balls, said apparatus comprising a reservoir for solder balls and means for moving a tooling fixture through said reservoir in a manner to populate recesses in said tooling fixture with said solder balls, said apparatus also including means for securing a ball grid array in a position corresponding to that of said tooling fixture, said ball grid array also including recesses therein, the recesses in said tooling fixture and in said ball grid array facing each other, said apparatus including means for dropping solder balls in recesses in said tooling fixture into corresponding recesses in said ball grid array under the force of gravity.

7. Apparatus as in claim 6 wherein said apparatus includes a wheel having an inner and an outer face, said fixture being attached to said outer face and said ball grid array being attached to said inner face, said means for moving comprising means for rotating said wheel.

8. Apparatus as in claim 7 wherein said wheel rotates through first and second positions at which said fixture is beneath said ball grid array and at which said ball grid array is beneath said fixture, said reservoir being located at said first position.

9. Apparatus as in claim 8 also including means for moving said fixture and said ball grid array into juxtaposition before said second position is reached and after said first position is reached.

10. A method for filling the recesses in a ball grid array with solder balls located in an array of recesses in a tooling fixture, said method comprising the steps of placing said ball grid array and said fixture in closely spaced apart positions, recesses facing, moving said array and said fixture about a circular path through first and second positions at which said fixture is beneath said array and at which said array is beneath said fixture, respectively, moving said array and said fixture into said first position such that only said fixture enters a reservoir of said solder balls, moving said array and said fixture to said second position at which gravity acts to transfer solder balls in recesses in said fixture into recesses in said array, and moving said array and said fixture into juxtaposition before said second position is reached.