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Thermoelectric module having reduced spacing between semiconductor elements

  • US 5,515,238 A
  • Filed: 02/28/1995
  • Issued: 05/07/1996
  • Est. Priority Date: 10/22/1993
  • Status: Expired due to Fees
First Claim
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1. In an improved thermoelectric module havingfirst and second substrates, each having a surface bearing an electrically conductive pattern, and an array of first and second different type material elements between and in contact with said electrically conductive pattern of each substrate to form an electrical circuit, said first and second type thermoelectric material elements serially connected, said first and second type material elements alternating in said circuit, each said electrically conductive pattern comprisingrepeating columns of individual rectangular conductive patterns in a first direction, said conductive patterns in each column staggered with respect to conductive patterns in each neighboring column.

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