Electrical contact having a particulate surface

• US 5,527,591 A
• Filed: 12/02/1994
• Issued: 06/18/1996
• Est. Priority Date: 12/02/1994
• Status: Expired due to Term

• Current Assignee: Thomas & Betts International Incorporated (ABB Limited)
• Original Assignee: Augat, Inc. (TE Connectivity Ltd. (United Kingdom))
• Inventors: Dean, Gregory E., Crotzer, David R.
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): Lee, Kam F.
• Application Number:
  US08/349,042
• Time in Patent Office: 564 Days
• Field of Search: 439/75, 439/81, 439/82, 439/87, 439/119, 439/447, 439/553, 439/445, 439/544, 439/91, 439/931
• US Class Current: 428/209
• CPC Class Codes: H01H 1/06 characterised by the shape or structure of the contact-making surface, e.g. grooved
• CPC Class Codes: H01H 1/60 Auxiliary means structurally associated with the switch for cleaning or lubricating contact-making surfaces cleaning by normal sliding of contacts H01H1/18, H01H1/36
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/023 Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate rigid curved substrate H05K2201/09018
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/095 Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
• CPC Class Codes: H05K 2203/1168 Graft-polymerization
• CPC Class Codes: H05K 2203/1344 Spraying small metal particles or droplets of molten metal
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10S 439/931 Conductive coating
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

The present invention comprises an electrical contact having solid homogenous conductive particles on the contact surface. The particles are of greater hardness than that of the contact material to deform the contact material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer. The particles are applied to the contact surface by a technique which results in the particles being intimately bonded to the contact surface, usually as a layer of particles. A preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact material.

Claims

1. An electrical contact comprising:

a substrate having a contact surface;

a plurality of solid homogenous conductive particles permanently applied to the contact surface so as to provide a conductive contact area;

wherein the conductive particles have a hardness in the range of 100-7000 on the Knoop scale, and a size range from about 200 microinches to about 1 microinch or less, the particle size being greater than the thickness of an oxide or other contaminating coating on a mating contact surface.

2. The electrical contact of claim 1 wherein the conductive particles are bonded to the contact surface by hypervelocity oxygen fuel spraying.

3. The electrical contact of claim 1 wherein the conductive particles are bonded to the contact surface by plasma spraying.

4. The electrical contact of claim 1 wherein the conductive particles have a hardness greater than that of the contact material as measured on the Knoop scale.

5. The electrical contact of claim 1 wherein the conductive particles are composed of carborundum with a conductive material dispersed therein.

6. The electrical contact of claim 1 wherein the conductive particles are composed of a noble metal.

7. The electrical contact of claim 1 wherein the conductive particles are composed of a conductive compound.

8. An electrical circuit board comprising:

an insulating substrate having a surface;

a plurality of electrical contact areas on the surface;

a plurality of solid homogeneous conductive particles permanently applied to each electrical contact area, the particles having a hardness greater than the hardness of the contact material of the electrical contact areas;

wherein the conductive particles have a hardness in the range of 100-7000 on the Knoop scale, and a size range from about 200 microinches to about 1 microinch or less, the particle size being greater than the thickness of an oxide or other contaminating coating on mating contact areas.

9. The circuit board of claim 8 wherein the substrate is rigid and further including a resilient layer between the substrate surface and the electrical contact areas.

10. An electrical device comprising:

a substrate of electrically insulating material;

an electrical contact material on at least a portion of the substrate;

a plurality of solid homogeneous conductive particles permanently applied to the electrical contact material so as to provide a conductive particulate contact area;

wherein the conductive particles have a hardness in the range of 100-7000 on the Knoop scale, and a size range from about 200 microinches to about 1 microinch or less, the particle size being greater than the thickness of an oxide or other contaminating coating on the contact area of a mating contact material.