Pb-free Sn-Ag-Cu ternary eutectic solder

  • US 5,527,628 A
  • Filed: 02/24/1995
  • Issued: 06/18/1996
  • Est. Priority Date: 07/20/1993
  • Status: Expired due to Term
First Claim
Patent Images

1. A Pb-free electrical conductor solder consisting essentially of about 3.5 to about 7.7 weight % Ag, about 1.0 to about 4.0 weight % Cu and the balance essentially Sn wherein Sn is present in an amount of at least about 89 weight % Sn to promote formation of intermetallic compounds that improve solder strength and fatigue resistance.

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