Method for manufacturing test simulation in electronic circuit design

• US 5,539,652 A
• Filed: 02/07/1995
• Issued: 07/23/1996
• Est. Priority Date: 02/07/1995
• Status: Expired due to Term

• Current Assignee: Keysight Technologies, Inc.
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Tegethoff, Mauro V.
• Primary Examiner(s): Teska, Kevin J.
• Assistant Examiner(s): FREJD, RUSSELL WARREN
• Application Number:
  US08/384,909
• Time in Patent Office: 532 Days
• Field of Search: 364/488, 364/489, 364/490, 364/491, 364/578, 364/468
• US Class Current: 703/14
• CPC Class Codes: G01R 31/2846 using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
• CPC Class Codes: G01R 31/318591 Tools
• CPC Class Codes: G06F 11/261 by simulating additional hardware, e.g. fault simulation
• CPC Class Codes: G06F 2111/08 Probabilistic or stochastic CAD
• CPC Class Codes: G06F 30/20 Design optimisation, verification or simulation optimisation, verification or simulation of circuit designs G06F30/30

Abstract

A manufacturing and test simulation method for electronic circuit design integrated with computer aided design tools to provide concurrent engineering of manufacturing and testability aspects of a product concurrent with the functional design of a product. The manufacturing and test simulator (MTSIM) simulates manufacturing test and repair aspects of boards and multichip modules (MCMs) from design concept through manufacturing release to aid the designer in selecting appropriate trade-offs in the design for manufacturability and the design for testability. All simulation by the methods of the present invention applies manufacturing and test models down to the component level. The methods of the simulator include a new yield model for boards and MCMs which accounts for the clustering of solder defects. MTSIM models solder faults, manufacturing workmanship faults, component performance faults, and reliability faults. Fault probabilities for the circuit design are estimated based on the component type, the component functionality, and the assembly process used. Up to seven manufacturing test steps can be simulated by MTSIM. Test coverage models will support all commonly used manufacturing test methodologies, including visual inspection, in-circuit test, IEEE 1149.1 boundary scan, selftest, diagnostics, and burn-in. Pareto and iterative "what-if" analysis may be used to locate particular enhancements which most benefit the manufacturability and testability of the product.

Claims

1. A method, operable on a computer, for estimating manufacturing test and quality attributes of an electronic assembly concurrent with the design of said electronic assembly comprising the steps of:

providing a description of the design of said electronic assembly;

providing pre-determined test and quality information relating to each component in said electronic assembly;

providing a description of a manufacturing test process; and

simulating said manufacturing test process, responsive to the description of the design of said electronic assembly and to the predetermined test and quality information, to estimate said manufacturing test and quality attributes.

2. The method of claim 1 wherein the step of simulating further comprises the steps of:

estimating an incoming fault probability value for said each component in said electronic assembly by applying said pre-determined test and quality information corresponding to said each component; and

simulating application of said manufacturing test process to said incoming fault probability value to estimate said manufacturing test and quality attributes.

3. The method of claim 2 wherein said manufacturing test and quality attributes comprise at least one attribute selected from the group consisting of:

manufacturing test coverage, manufacturing test isolation, manufacturing test costs, assembly reliability, assembly repair costs, and assembly yield.

4. The method of claim 2 wherein the step of simulating application of said manufacturing test process further comprises the steps of:

estimating the average number of defects (Do) in said electronic assembly as;

##EQU37## where;

Pfi_j is the incoming fault probability value corresponding to the j'"'"'th said component in said electronic assembly,

TC_j is a test coverage value corresponding to the j'"'"'th said component in said electronic assembly, and

N is the number of components in said electronic assembly; and

estimating the yield of said electronic assembly in response to the application of said manufacturing process and in response to the estimation of said average number of defects (Do).

5. The method of claim 4 wherein the incoming fault probability value (Pfi) of said j'"'"'th component is determined as:

space="preserve" listing-type="equation">Pfi=1-(1-fp).sup.n

where;

n is the number of trials for a fault type in a component and is derived from said pre-determined test and quality information,

fp is the fault probability and is derived from said pre-determined test and quality information.

6. The method of claim 4 wherein yield (Y) is determined as:

space="preserve" listing-type="equation">Y=Ycl+Yncl

where;

Ycl is a yield determined from clustered solder defects, and

Yncl is a yield determined from non-clustered assembly defects and functional defects.

7. The method of claim 6 wherein said Ycl is determined as:

##EQU38## where;

α

is the clustering factor.

8. The method of claim 7 further comprising the step of:

providing information relating to the assembly process used for said electronic assembly;

estimating the clustering factor (α

) as;

##EQU39## where;

μ

is the mean number of defects for said assembly process, and

σ

is the standard deviation of said number of defects for said assembly process.

9. The method of claim 6 wherein said Yncl is determined as:

space="preserve" listing-type="equation">Yncl=e.sup.-Do

10. The method of claim 4:

wherein said manufacturing test process comprises at least one test attribute applicable to each of said components of said electronic assembly, said at least one test attribute selected from the group consisting of;

in-circuit, boundary scan, self test, functional test, stress test, and inspection; and

wherein said test coverage value (TC) of said j'"'"'th component is determined as the largest test coverage value of all test attributes applicable to the j'"'"'th component of said electronic assembly.

11. The method of claim 1 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each component used in said electronic assembly with respect a contribution of each component to said manufacturing test and quality attributes.

12. The method of claim 1 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each unique part number of all components used in said electronic assembly with respect to a contribution of each unique part number to said manufacturing test and quality attributes.

13. The method of claim 1 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each category of components used in said electronic assembly with respect to a contribution of each category of components to said manufacturing test and quality attributes.

14. A method, operable on a computer, for estimating manufacturing test and quality attributes of an electronic assembly concurrent with the design of said electronic assembly comprising the steps of:

(a) providing a description of the design of said electronic assembly;

(b) providing pre-determined test and quality information relating to each component in said electronic assembly;

(c) providing a description of a manufacturing test process wherein said manufacturing test process comprises a plurality of sequential test steps;

(d) estimating an incoming fault probability value for said each component in said electronic assembly by applying said pre-determined test and quality information corresponding to said each component, wherein said incoming fault probability corresponds to a first of said sequential test steps;

(e) assigning the first of said sequential test steps as the current test step;

(f) simulating application of the current test step to said incoming fault probability value to estimate said manufacturing test and quality attributes;

(g) determining an outgoing fault probability corresponding to the fault probability for each component in said electronic assembly following application of said next test step, wherein said outgoing fault probability is usable as an incoming fault probability value in subsequent invocations of step (f);

(h) assigning the next of said sequential test steps as the current test step; and

(h) repeating steps (f) and (g) and (h) for each of said plurality of test steps of said manufacturing test process.

15. The method of claim 14 wherein said manufacturing test and quality attributes comprise at least one attribute selected from the group consisting of:

manufacturing test coverage, manufacturing test isolation, manufacturing test costs, assembly reliability, assembly repair costs, and assembly yield.

16. The method of claim 14 wherein the step of simulating application of said manufacturing test process further comprises the steps of:

estimating the average number of defects (Do) in said electronic assembly as;

##EQU40## where;

Pfi_j is the incoming fault probability value corresponding to the j'"'"'th said component in said electronic assembly,

TC_j is a test coverage value corresponding to the j'"'"'th said component in said electronic assembly, and

N is the number of components in said electronic assembly; and

estimating the yield of said electronic assembly in response to the application of said manufacturing process and in response to the estimation of said average number of defects (Do).

17. The method of claim 16 wherein the incoming fault probability value (Pfi) of said j'"'"'th component is determined as:

space="preserve" listing-type="equation">Pfi=1-(1-fp).sup.n

where;

n is the number of trials for the a fault type of a component and is derived from said pre-determined test and quality information,

fp is the fault probability and is derived from said pre-determined test and quality information.

18. The method of claim 16 wherein a yield (Y) is determined as:

space="preserve" listing-type="equation">Y=Ycl+Yncl

where;

Ycl is a yield determined from clustered solder defects, and

Yncl is a yield determined from non-clustered assembly defects and functional defects.

19. The method of claim 18 wherein said Ycl is determined as:

##EQU41## where;

α

is the clustering factor.

20. The method of claim 19 further comprising the step of:

providing information relating to the assembly process used for said electronic assembly;

estimating the clustering factor (α

) as;

##EQU42## where;

μ

is the mean number of defects for said assembly process, and

σ

is the standard deviation of said number of defects for said assembly process.

21. The method of claim 18 wherein said Yncl is determined as:

space="preserve" listing-type="equation">Yncl=e.sup.-Do

22. The method of claim 16:

wherein each test step of said manufacturing test process comprises at least one test attribute applicable to each of said components of said electronic assembly, said at least one test attribute selected from the group consisting of;

in-circuit, boundary scan, self test, functional test, stress test, and inspection; and

wherein said test coverage value (TC) of said j'"'"'th component is determined as the largest test coverage value of all test attributes applicable to the j'"'"'th component of said electronic assembly of said current test step.

23. The method of claim 14 wherein the outgoing fault probability value (Pfo) of said j'"'"'th component is determined as:

space="preserve" listing-type="equation">Pfo=1-(1-Pfi).sup.1-TC)

24. The method of claim 14 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each component used in said electronic assembly with respect to a contribution of each component to said manufacturing test and quality attributes.

25. The method of claim 14 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each unique part number of all components used in said electronic assembly with respect to a contribution of each unique part number to said manufacturing test and quality attributes.

26. The method of claim 14 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each category of components used in said electronic assembly with respect to a contribution of each category of components to said manufacturing test and quality attributes.

27. A method, operable on a computer, for estimating manufacturing test and quality attributes of an electronic assembly attributable to a predetermined manufacturing test process, said method comprising the steps of:

providing a description of the design of said electronic assembly;

providing pre-determined test and quality information relating to each component in said electronic assembly; and

simulating said manufacturing test process, responsive to the description of the design of said electronic assembly and to the predetermined test and quality information, to estimate said manufacturing test and quality attributes attributable to said pre-determined manufacturing test process.

28. The method of claim 27 wherein the step of simulating further comprises the steps of:

estimating an incoming fault probability value for said each component in said electronic assembly by applying said pre-determined test and quality information corresponding to said each component; and

simulating application of said manufacturing test process to said incoming fault probability value to estimate said manufacturing test and quality attributes.

29. The method of claim 28 wherein said manufacturing test and quality attributes comprise at least one attribute selected from the group consisting of:

manufacturing test coverage, manufacturing test isolation, manufacturing test costs, assembly reliability, assembly repair costs, and assembly yield.

30. The method of claim 28 wherein the step of simulating application of said manufacturing test process further comprises the steps of:

estimating the average number of defects (Do) in said electronic assembly as;

##EQU43## where;

Pfi_j is the incoming fault probability value corresponding to the j'"'"'th said component in said electronic assembly,

TC_j is a test coverage value corresponding to the j'"'"'th said component in said electronic assembly, and

N is the number of components in said electronic assembly; and

estimating the yield of said electronic assembly in response to the application of said manufacturing process and in response to the estimation of said average number of defects (Do).

31. The method of claim 30 wherein the incoming fault probability value (Pfi) of said j'"'"'th component is determined as:

space="preserve" listing-type="equation">Pfi=1-(1-fp).sup.n

where;

n is the number of trials for a fault type of a component and is derived from said pre-determined test and quality information,

fp is the fault probability and is derived from said pre-determined test and quality information.

32. The method of claim 30 wherein a yield (Y) is determined as:

space="preserve" listing-type="equation">Y=Ycl+Yncl

where;

Ycl is a yield determined from clustered solder defects, and

Yncl is a yield determined from non-clustered assembly defects and functional defects.

33. The method of claim 32 wherein said Ycl is determined as:

##EQU44## where;

α

is the clustering factor.

34. The method of claim 33 further comprising the step of:

providing information relating to the assembly process used for said electronic assembly;

estimating the clustering factor (α

) as;

##EQU45## where;

μ

is the mean number of defects for said assembly process, and

σ

is the standard deviation of said number of defects for said assembly process.

35. The method of claim 32 wherein said Yncl is determined as:

space="preserve" listing-type="equation">Yncl=e.sup.-Do

36. The method of claim 30:

wherein said manufacturing test process comprises at least one test attribute applicable to each of said components of said electronic assembly, said at least one test attribute selected from the group consisting of;

in-circuit, boundary scan, self test, functional test, stress test, and inspection; and

wherein said test coverage value (TC) of said j'"'"'th component is determined as the largest test coverage value of all test attributes applicable to the j'"'"'th component of said electronic assembly.

37. The method of claim 27 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each component used in said electronic assembly with respect to a contribution of each component to said manufacturing test and quality attributes.

38. The method of claim 27 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each unique part number of all components used in said electronic assembly with respect to a contribution of each unique part number to said manufacturing test and quality attributes.

39. The method of claim 27 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each category of components used in said electronic assembly with respect to a contribution of each category of components to said manufacturing test and quality attributes.

40. A method, operable on a computer, for estimating manufacturing test and quality attributes of an electronic assembly attributable to a predetermined manufacturing assembly process, said method comprising the steps of:

providing a description of the design of said electronic assembly;

providing pre-determined test and quality information relating to each component in said electronic assembly;

providing a description of a manufacturing test process; and

simulating said manufacturing test process, responsive to the description of the design of said electronic assembly and to the predetermined test and quality information, to estimate said manufacturing test and quality attributes attributable to said pre-determined manufacturing assembly process.

41. The method of claim 40 wherein the step of simulating further comprises the steps of:

estimating an incoming fault probability value for said each component in said electronic assembly by applying said pre-determined test and quality information corresponding to said each component; and

simulating application of said manufacturing test process to said incoming fault probability value to estimate said manufacturing test and quality attributes.

42. The method of claim 41 wherein said manufacturing test and quality attributes comprise at least one attribute selected from the group consisting of:

manufacturing test coverage, manufacturing test isolation, manufacturing test costs, assembly reliability, assembly repair costs, and assembly yield.

43. The method of claim 41 wherein the step of simulating application of said manufacturing test process further comprises the steps of:

estimating the average number of defects (Do) in said electronic assembly as;

##EQU46## where;

Pfi_j is the incoming fault probability value corresponding to the j'"'"'th said component in said electronic assembly,

TC_j is a test coverage value corresponding to the j'"'"'th said component in said electronic assembly, and

N is the number of components in said electronic assembly; and

estimating the yield of said electronic assembly in response to the application of said manufacturing process and in response to the estimation of said average number of defects (Do).

44. The method of claim 43 wherein the incoming fault probability value (Pfi) of said j'"'"'th component is determined as:

space="preserve" listing-type="equation">Pfi=1-(1-fp).sup.n

where;

n is the number of trials for a fault type of a component and is derived from said pre-determined test and quality information,

fp is the fault probability and is derived from said pre-determined test and quality information.

45. The method of claim 43 wherein a yield (Y) is determined as:

space="preserve" listing-type="equation">Y=Ycl+Yncl

where;

Ycl is a yield determined from clustered solder defects, and

Yncl is a yield determined from non-clustered assembly defects and functional defects.

46. The method of claim 45 wherein said Ycl is determined as:

##EQU47## where;

α

is the clustering factor.

47. The method of claim 46 further comprising the step of:

providing information relating to the assembly process used for said electronic assembly;

estimating the clustering factor (α

) as;

##EQU48## where;

μ

is the mean number of defects for said assembly process, and

σ

is the standard deviation of said number of defects for said assembly process.

48. The method of claim 45 wherein said Yncl is determined as:

space="preserve" listing-type="equation">Yncl=e.sup.-Do

49. The method of claim 43:

wherein said manufacturing test process comprises at least one test attribute applicable to each of said components of said electronic assembly, said at least one test attribute selected from the group consisting of;

in-circuit, boundary scan, self test, functional test, stress test, and inspection; and

wherein said test coverage value (TC) of said j'"'"'th component is determined as the largest test coverage value of all test attributes applicable to the j'"'"'th component of said electronic assembly.

50. The method of claim 40 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each component used in said electronic assembly with respect to a contribution of each component to said manufacturing test and quality attributes.

51. The method of claim 40 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each unique part number of all components used in said electronic assembly with respect to a contribution of each unique part number to said manufacturing test and quality attributes.

52. The method of claim 40 further comprising the steps of:

performing pareto analysis ranking of said electronic assembly with respect to said manufacturing test and quality attributes of said electronic assembly, wherein said pareto analysis ranks each category of components used in said electronic assembly with respect to a contribution of each category of components to said manufacturing test and quality attributes.

53. A system, operable on a computer, for estimating manufacturing test and quality attributes of an electronic assembly concurrent with the design of said electronic assembly, comprising:

means for providing information on the design of said electronic assembly;

means for providing pre-determined test and quality information relating to each component in said electronic assembly;

means for providing information on a manufacturing test process; and

means for simulating said manufacturing test process, responsive to the information on the design of said electronic assembly and to the pre-determined test and quality information, to estimate said manufacturing test and quality attributes.

54. A system, operable on a computer, for estimating manufacturing test and quality attributes of an electronic assembly concurrent with the design of said electronic assembly, comprising:

(a) means for providing information on the design of said electronic assembly;

(b) means for providing pre-determined test and quality information relating to each component in said electronic assembly;

(c) means for providing information on a manufacturing test process wherein said manufacturing test process comprises a plurality of sequential test steps;

(d) means for estimating an incoming fault probability value for said each component in said electronic assembly by applying said pre-determined test and quality information corresponding to said each component, wherein said incoming fault probability corresponds to a first of said sequential test steps;

(e) means for assigning the first of said sequential test steps as the current test step;

(f) means for simulating application of the current test step to said incoming fault probability value to estimate said manufacturing test and quality attributes;

(g) means for determining an outgoing fault probability corresponding to the fault probability for each component in said electronic assembly following application of said next test step, wherein said outgoing fault probability is usable as an incoming fault probability value in subsequent invocations of said stimulating means;

(h) means for assigning the next of said sequential test steps as the current test step; and

(i) means for activating said simulating means, said determining means, and said second assigning means for each of said plurality of test steps of said manufacturing test process.

55. A system, operable on a computer, for estimating manufacturing test and quality attributes of an electronic assembly attributable to a pre-determined manufacturing test process, said system comprising:

means for providing information on the design of said electronic assembly;

means for providing pre-determined test and quality information relating to each component in said electronic assembly; and

means for simulating said manufacturing test process, responsive to the information on the design of said electronic assembly and to the pre-determined test and quality information, to estimate said manufacturing test and quality attributes attributable to said pre-determined manufacturing test process.

56. A system, operable on a computer, for estimating manufacturing test and quality attributes of an electronic assembly attributable to a pre-determined manufacturing assembly process, said system comprising:

means for providing information on the design of said electronic assembly;

means for providing pre-determined test and quality information relating to each component in said electronic assembly;

means for providing information on a manufacturing test process; and

means for simulating said manufacturing test process, responsive to the information on the design of said electronic assembly and the pre-determined test and quality information, to estimate said manufacturing test and quality attributes attributable to said pre-determined manufacturing assembly process.