Solid state imaging device

• US 5,563,429 A
• Filed: 06/14/1994
• Issued: 10/08/1996
• Est. Priority Date: 06/14/1994
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Isogai, Tadao
• Primary Examiner(s): Munson, Gene M.
• Application Number:
  US08/261,135
• Time in Patent Office: 847 Days
• Field of Search: 257/257, 257/258, 257/291, 257/292, 257/136
• US Class Current: 257/258
• CPC Class Codes: H01L 27/1446 in a repetitive configuration

Abstract

An amplification-type solid state imaging device includes a plurality of photoelectric conversion devices each adapted to receive incident light to produce a signal charge and a plurality of signal reading devices to read a signal charge produced from one of the photoelectric conversion devices. The photoelectric conversion device includes a photodiode and the signal reading device includes an amplifying transistor for amplifying the signal charge so that the signal charge generated by the photodiode is transferred to the amplifying transistor by one of a plurality of transfer devices.

Claims

1. A solid state imaging device including a plurality of picture elements provided on a semiconductor substrate, each of said picture elements comprising:

a photoelectric conversion device including a photodiode for photoelectrically converting received incident light to produce a signal charge and for storing said signal charge therein;

a junction-type field effect transistor adapted to amplify said signal charge from said photodiode, said transistor including a source region of a first conductivity type, a drain region of said first conductivity type, a gate region of a second conductivity type disposed between said source region and said drain region, a gate electrode disposed over and isolated from said gate region with an isolator film layer lying between said gate region and said gate electrode; and

a transfer device adapted to control electrical connection between said photoelectric conversion device and said transistor so that said electrical connection alternates between a state of cutoff and a state of conduction and said signal charge stored in said photodiode is transferred to said transistor when said electrical connection is in said state of conduction.

2. A solid state imaging device according to claim 1, wherein said photodiode is formed as a buried photodiode having a diffused region provided over a portion of a P-N junction region of said photodiode, said diffused region being of a conductivity type opposite to a conductivity type of said photodiode.

3. A solid state imaging device according to claim 1, wherein said transfer device includes a transfer electrode disposed between and isolated from both said photoelectric conversion device and said transistor with an isolator film layer disposed below said transfer electrode.

4. A solid state imaging device according to claim 3, wherein said transfer electrode is disposed over a part of said gate region and over a part of said photoelectric conversion device, and wherein said transfer electrode is isolated from said part of said gate region and from said part of said photoelectric conversion device by said isolator film layer.

5. A solid state imaging device according to claim 1, wherein each of said picture elements further comprises a light-shielding film overlying a portion of said transistor to prevent the incidence of light into said transistor and an isolator film lying between said light-shielding film and said portion.

6. A solid state imaging device according to claim 1, wherein said photodiode is formed as a buried photodiode including a well region of a first conductivity type, a photodiode region of a second conductivity type disposed on said well region, and a diffused region of said first conductivity type provided on said photodiode region, said first conductivity type and said second conductivity type being opposite in conductivity to each other.

7. A solid state imaging device including a plurality of picture elements provided on a semiconductor substrate, each of said picture elements comprising:

a photoelectric conversion device including a buried photodiode for photoelectrically converting received incident light to produce a signal charge and for storing said signal charge therein, said photodiode being composed of an NPN-type vertical structure including an N-type well region, a P-type photodiode region which is disposed on said N-type well region and an N-type diffused region which is disposed on said photodiode region;

a junction-type field effect transistor adapted to amplify said signal charge from said photodiode, said transistor including an N-type source region, an N-type drain region, a P-type gate region disposed between said source region and said drain region, a gate electrode disposed over and isolated from said gate region with an isolator film layer lying between said gate region and said gate electrode; and

a transfer device adapted to control electrical connection between said photoelectric conversion device and said transistor so that said electrical connection alternates between a state of cutoff and a state of conduction and said signal charge stored in said photodiode is transferred to said gate region of said transistor when said connection is in said state of conduction.

8. A solid state imaging device according to claim 7, wherein said transfer device includes a transfer electrode disposed between and isolated from both said photoelectric conversion device and said transistor with an isolator film layer disposed below said transfer electrode.

9. A solid state imaging device according to claim 8, wherein said transfer electrode is disposed over a part of said gate region and over a part of said photoelectric conversion device, and wherein said transfer electrode is isolated from said part of said gate region and from said part of said photoelectric conversion device by said isolator film layer.

10. A solid state imaging device including a plurality of picture elements provided on a P-type semiconductor substrate, each of said picture elements comprising:

a photoelectric conversion device including a buried photodiode for photoelectrically converting received incident light to produce a signal charge and for storing said signal charge therein, said photodiode being composed of an NPNNP-type vertical structure including said P-type semiconductor substrate, an N-type diffused layer which is disposed on said semiconductor substrate, an N-type well region which is provided on said N-type diffused layer, a P-type photodiode region which is disposed on said N-type well region and an N-type diffused region which is disposed on said photodiode region;

a junction-type field effect transistor adapted to amplify said signal charge from said photodiode, said transistor being composed of a structure including an N-type source region disposed in said N-type diffused layer, an N-type drain region disposed in said N-type diffused layer, a P-type gate region disposed between said source region and said drain region within said N-type diffused layer, a gate electrode disposed over and isolated from said gate region with an isolator film layer lying between said gate region and said gate electrode; and

a transfer device adapted to control electrical connection between said photoelectric conversion device and said transistor so that said electrical connection alternates between a state of cutoff and a state of conduction and said signal charge stored in said photodiode is transferred to said gate region of said transistor when said connection is in said state of conduction, said transfer device including a transfer electrode disposed between and isolated from both said photoelectric conversion device and said transistor with an isolator film layer disposed below said transfer electrode.

11. A solid state imaging device according to claim 10, wherein said transfer electrode is disposed over a part of said gate region and over a part of said photoelectric conversion device, and wherein said transfer electrode is isolated from said part of said gate region and from said part of said photoelectric conversion device by said isolator film layer.

12. A solid state imaging device according to claim 11, wherein each of said picture elements further comprises a light-shielding film overlying a portion of said transistor to prevent the incidence of light into said transistor and an isolator film lying between said light-shielding film and said portion.