LED lamp and arrangement for mounting LED lamps on a substrate

• US 5,564,819 A
• Filed: 03/28/1995
• Issued: 10/15/1996
• Est. Priority Date: 04/04/1994
• Status: Expired due to Term

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Yamaguchi, Tomoji
• Primary Examiner(s): Yeung, James C.
• Assistant Examiner(s): Sember, Thomas M.
• Application Number:
  US08/411,541
• Time in Patent Office: 567 Days
• Field of Search: 362/241, 362/247, 362/248, 362/249, 362/252, 362/237, 362/800, 362/311, 313/500, 313/512
• US Class Current: 362/241
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

An LED lamp has a first lead formed with a reflecting plate at an upper end and a pair of further leads spaced on opposite sides of the first lead, and a plurality of LED chips mounted in linear spaced relation on the reflecting plate. The direction Y of the spacing of the plurality of LED chips is inclined at a predetermined angle α to the spacing direction X of the leads. The reflecting plate has an elongated shape and the plurality of LED chips are spaced in the direction of elongation of the reflecting plate.

Claims

1. An LED lamp arrangement comprising a first lead having a reflecting plate formed at one end, two further leads spaced on opposite sides of the first lead, and a plurality of LED chips mounted in linearly spaced relation on the reflecting plate, wherein a direction of linear spacing of the plurality of LED chips is inclined at a predetermined angle relative to a direction of spacing of the two further leads.

2. An LED lamp according to claim 1 wherein the reflecting plate has an elongated shape and the plurality of LED chips are arranged in a direction of elongation of the reflecting plate, and wherein the direction of elongation of the reflecting plate is inclined at a predetermined angle relative to the direction of spacing of the two further leads.

3. An LED lamp according to claim 1 wherein the inclination angle is in a range of from about 5 to about 85 degrees.

4. An LED lamp arrangement comprising a substrate and a plurality of LED lamps each comprising a first lead having a reflecting plate formed at one end, two further leads spaced on opposite sides of the first lead, and a plurality of LED chips mounted in linearly spaced relation on the reflecting plate, wherein a direction of linear spacing of the plurality of LED Chips is inclined at a predetermined angle relative to a direction of spacing of the two further leads, wherein the plurality of LED lamps are arranged in a longitudinally and transversely extending array on the substrate.

5. An LED lamp arrangement according to claim 4 wherein the directions of spacing of the LED chips in each of the LED lamps coincide with a longitudinal direction of the array of lamps on the substrate.

6. An LED lamp arrangement according to claim 4 wherein the directions of spacing of the LED chips in each of the LED lamps coincide with a transverse direction of the array of lamps on the substrate.