Stamped and formed heat sink

• US 5,566,749 A
• Filed: 10/10/1995
• Issued: 10/22/1996
• Est. Priority Date: 04/12/1994
• Status: Expired due to Fees

• Current Assignee: Aavid Thermalloy LLC (LTI Flexible Products Inc.)
• Original Assignee: Thermalloy, Inc. (Ansys Incorporated)
• Inventors: Smithers, Matthew C., Jordan, William D.
• Primary Examiner(s): Leo, Leonard R.
• Application Number:
  US08/544,060
• Time in Patent Office: 378 Days
• Field of Search: 165/80.3, 165/121, 165/122, 165/125, 165/185, 174/16.1, 174/16.3, 257/721, 257/722, 361/692, 361/694, 361/695, 361/697, 361/702, 361/703, 361/704, 361/707
• US Class Current: 165/80.3
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A stamped and formed heat sink has a thermally conductive body including a base having a face adapted for attachment to an electronic device package. Stamped and formed heat dissipation elements extend from the edges of the base perpendicular to the base. The heat sink is formed in a progressive punch and die press so that a heat sink is produced on every stroke.

Claims

1. A heat sink for use with a fan to cool an electronic device comprising:

a thermally conductive sheet body forming a base having a face for attachment to said electronic device;

heat dissipation elements bent from said sheet body and extending from opposed edges of said base perpendicular to said base;

openings stamped in said heat dissipation elements for the flow of air into said body;

said heat dissipating elements being spaced for an interference fit with said fan, said fan being snapped into said heat dissipating elements; and

detents formed by slots in said heat dissipating elements, said detents snapping over said fan when said fan is inserted into said heat sink apparatus.

2. The heat sink apparatus recited in claim 1 wherein said fan snaps into the top of said body.

3. The heat sink apparatus recited in claim 1 wherein said fan has plastic snap clips which engage fingers on two opposing heat dissipation elements in a snap fit.

4. The heat sink apparatus recited in claim 1 wherein one of said heat dissipation elements has a height which is lower than the other heat dissipation elements, the top edge of said heat dissipation element having lower height forming a ledge on which said fan rests.

5. The heat sink apparatus recited in claim 4 wherein said fan snaps into said body when said fan is inserted from the side on which said lower heat sink element extends.

6. The heat sink apparatus recited in claim 1 wherein two opposing heat dissipation elements have slots forming said detents and said fan has a housing, said detents snapping over said housing when said fan is inserted into said body.

7. The heat sink apparatus recited in claim 1 wherein a portion of at least one heat dissipation is bent into the center of said body to provide better thermal performance and to direct air swirling within said heat sink.

8. The heat sink apparatus recited in claim 7 further comprising:

said fan forcing air through said elements towards said base, said fan resting on an edge of said portion of said heat dissipation element.

9. The heat sink apparatus recited in claim 8 wherein two portions of two heat dissipation elements at the side of said body opposite said element having lower height are bent into the center of said body to form ledges on which said fan rests.

10. The heat sink apparatus recited in claim 1 wherein said electronic device package includes a socket and a pin grid array between said socket and said thermally conductive body;

and

means for attaching said thermally conductive body to said socket.