Semiconductor device-encapsulating epoxy resin composition
First Claim
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1. A semiconductor-encapsulating epoxy resin composition comprising (i) an epoxy resin, (ii) a curing agent comprising a mixture of 4,4'"'"'-dihydroxybiphenyl and a tri- or higher polyphenol, and (iii) 75 to 95% by weight, based on the total weight of said epoxy resin composition, of a filler;
- said epoxy resin including at least one bifunctional epoxy resin selected from the group consisting of bifunctional epoxy resins having a biphenyl radical represented by the following formula (I);
##STR5## wherein each of R1 through R8 independently represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms, and bifunctional epoxy resins having a naphthalene radical represented by the following formula (II);
##STR6## wherein two of R11 through R18 represent a 2,3-epoxypropoxy group and the others independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.
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Abstract
A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'"'"'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
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6 Claims
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1. A semiconductor-encapsulating epoxy resin composition comprising (i) an epoxy resin, (ii) a curing agent comprising a mixture of 4,4'"'"'-dihydroxybiphenyl and a tri- or higher polyphenol, and (iii) 75 to 95% by weight, based on the total weight of said epoxy resin composition, of a filler;
- said epoxy resin including at least one bifunctional epoxy resin selected from the group consisting of bifunctional epoxy resins having a biphenyl radical represented by the following formula (I);
##STR5## wherein each of R1 through R8 independently represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms, and bifunctional epoxy resins having a naphthalene radical represented by the following formula (II);
##STR6## wherein two of R11 through R18 represent a 2,3-epoxypropoxy group and the others independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. - View Dependent Claims (2, 3, 4, 5)
- said epoxy resin including at least one bifunctional epoxy resin selected from the group consisting of bifunctional epoxy resins having a biphenyl radical represented by the following formula (I);
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6. A semiconductor-encapsulating epoxy resin composition comprising (i) an epoxy resin, (ii) a curing agent comprising a mixture of 4,4'"'"'-dihydroxybiphenyl and another polyfunctional compound selected from the group consisting of a phenol-novolak resin, a cresol-novolak resin, and phenolic compounds represented by the following formula (III):
- ##STR7## wherein R represents a hydrogen atom, an aryl group having 6 to 7 carbon atoms or an alkyl group having 1 to 4 carbon atoms, and (iii) 75 to 95% by weight, based on the total weight of said epoxy resin composition, of a filler;
said epoxy resin including at least one bifunctional epoxy resin selected from the group consisting of bifunctional epoxy resins having a biphenyl radical represented by the following formula (I);
##STR8## wherein each of R1 through R8 independently represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms, and bifunctional epoxy resins having a naphthalene radical represented by the following formula (II);
##STR9## wherein two of R11 through R18 represent a 2,3-epoxypropoxy group and the others independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.
- ##STR7## wherein R represents a hydrogen atom, an aryl group having 6 to 7 carbon atoms or an alkyl group having 1 to 4 carbon atoms, and (iii) 75 to 95% by weight, based on the total weight of said epoxy resin composition, of a filler;
Specification