Apparatus for cooling charge coupled device imaging systems

• US 5,596,228 A
• Filed: 07/28/1995
• Issued: 01/21/1997
• Est. Priority Date: 03/10/1994
• Status: Expired due to Term

• Current Assignee: GE Medical Systems Global Technology Company LLC (GE Healthcare Technologies, Inc.)
• Original Assignee: OEC Medical Systems Incorporated (General Electric Company)
• Inventors: Anderton, Richard L., Curtis, Steven E.
• Primary Examiner(s): WHITEHEAD JR, CARL W
• Application Number:
  US08/508,576
• Time in Patent Office: 543 Days
• Field of Search: 257/712, 257/713, 257/714, 257/715, 257/716, 361/689, 361/698, 361/699, 361/702, 361/711
• US Class Current: 257/714
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H04N 5/32 Transforming X-rays cameras or camera modules for generating image signals from X-rays H04N23/30; circuitry of SSIS for transforming X-rays into image signals H04N25/30

Abstract

Apparatus for cooling charge-coupled device (CCD) imaging systems. The apparatus comprises a thermoelectric cooler thermally coupled to the imaging system for transferring heat away from and cooling the imaging system portion of the imaging system. The thermoelectric cooler has a cold side and an opposing hot side, with the cold side thermally coupled to the imaging sensor to enable the transfer of heat from the sensor in response to a supply of power. A power supply is coupled to the cooler for supplying required power. The hot side of the cooler is thermally coupled to a heat pipe, which is composed of a heat-conducting material having a hollow portion containing a wicking material and a working fluid. A heat sink is thermally coupled to the heat pipe enabling heat dissipation. The working fluid cyclically evaporates into vapor and condenses into liquid to effect the heat transfer from the heat pipe to the heat sink.

Claims

1. Apparatus for cooling a charge-coupled device imaging system, containing an imaging sensor, and the like comprising

a thermoelectric cooler thermally coupled to said system for transferring heat therefrom to cool the imaging sensor to approximately an ambient temperature, said thermoelectric cooler having a cold side and an opposing hot side, said cold side being thermally coupled to said imaging sensor to thereby cool the sensor in response to a supply of power;

a power supply coupled to the cooler for supplying power thereto;

a heat pipe means thermally coupled to said hot side for transferring heat therefrom, the heat pipe means comprising a tubular heat-conducting wall circumscribing a hollow portion, and a wicking material and a working fluid disposed in the hollow, and

a heat sink thermally coupled to the heat pipe means for transferring heat therefrom, and wherein the heat sink comprises a mass of thermally conductive material disposed so that it tracks ambient temperature.

2. Apparatus of claim 1 wherein the working fluid is selected from the group consisting of water, methanol, ethanol, and mixtures thereof.

3. Apparatus of claim 2 wherein the working fluid is water.

4. Apparatus of claim 1 further including a first block of thermally conductive material disposed between the imaging system and the cooler, and a second block of thermally conductive material disposed between the cooler and the heat pipe means.

5. Apparatus of claim 4 wherein said thermally conductive material is selected from the group consisting of copper, aluminum, and mixtures thereof.

6. Apparatus of claim 5 wherein the thermally conductive material is copper.

7. Apparatus of claim 1 wherein the wicking material comprises sintered copper.

8. A method of cooling a charge-coupled device imaging system and the like which controls moisture by ambient temperature tracking, comprising

(a) providing apparatus for cooling a charge-coupled device imaging system, containing an imaging sensor, and the like comprising

a thermoelectric cooler thermally coupled to said system for transferring heat therefrom to cool the imaging sensor to a reduced temperature, said thermoelectric cooler having a cold side and an opposing hot side, said cold side being thermally coupled to said imaging system to thereby cool the imaging sensor in response to a supply of power, such that the thermoelectric cooler provides ambient temperature tracking to control moisture;

a power supply coupled to the cooler for supplying power thereto;

a heat pipe thermally coupled to said hot side for transferring heat therefrom, the heat pipe comprising a tubular heat-conducting wall circumscribing a hollow portion that contains a wicking material and a working fluid; and

a heat sink thermally coupled to the heat pipe for transferring heat therefrom, and wherein the heat sink comprises a mass of thermally conductive material so positioned so that it tracks ambient temperature; and

(b) activating the power supply to provide power to the thermoelectric cooler for cooling the imaging sensor.

9. The method of claim 8 wherein heat transfer from the heat pipe to the heat sink is effected by evaporation of the working fluid into vapor, thereby transferring heat from the heat pipe to the vapor and causing an increase of pressure within the heat pipe, followed by condensation of the vapor into liquid in a portion of the heat pipe proximal to the heat sink, thereby transferring heat from the working fluid to the heat sink.

10. The method of claim 8 wherein the working fluid is selected from the group consisting of water, methanol, ethanol, and mixtures thereof.

11. The method of claim 10 wherein the working fluid is water.

12. The method of claim 8 wherein the cold side of the thermoelectric cooler is coupled to the imaging sensor through a first block of thermally conductive material, and the hot side of the thermoelectric cooler is coupled to the heat pipe through a second block of thermally conductive material.

13. The method of claim 12 wherein said thermally conductive material is selected from the group consisting of copper, aluminum, and mixtures thereof.

14. The method of claim 13 wherein the thermally conductive material is copper.

15. The method of claim 8 wherein the wicking material comprises sintered copper.