Method of manufacturing a circuit assembly

• US 5,607,538 A
• Filed: 09/07/1995
• Issued: 03/04/1997
• Est. Priority Date: 09/07/1995
• Status: Expired due to Fees

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Ford Motor Company
• Inventors: Cooke, William E.
• Primary Examiner(s): STEMMER, DANIEL J
• Application Number:
  US08/524,498
• Time in Patent Office: 544 Days
• Field of Search: 156/290, 156/291, 156/292, 361/704, 361/705, 361/717, 361/718, 361/719
• US Class Current: 156/291
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A method of manufacturing a circuit assembly is provided. The circuit assembly (10) manufactured according to the present invention includes a circuit board (12) and a heat sink (22). The circuit board (12) has a first side (16) and a second side (20), and each of these sides (16, 20) has one or more electronic components (14, 18) mounted thereon. The heat sink (22) also includes a first side (34) and a second side (43), the first side (34) having a recessed portion (24) therein. The method of manufacturing the circuit assembly (10) includes the step of dispensing a heat curable adhesive (26) between the mating surfaces (30, 32) of the second side (20) of the circuit board (12) and the first side (34) of the heat sink (22). The method also includes the step of positioning the circuit board (12) such that the component (18) on its second side (20) is aligned with the recessed portion (24) of the heat sink (22). The method further includes the step of urging the mating surfaces (30, 32) towards one another and applying heat through the heat sink (22) to cure the adhesive (26).

Claims

1. A method of manufacturing a circuit assembly including a circuit board having first and second sides with at least one electronic component mounted on each of said sides, and a heat sink attached to said circuit board, said heat sink having first and second sides, said first side having a recessed portion, said second side of said circuit board and said first side of said heat sink each having corresponding mating surfaces, comprising the steps of:

dispensing a thermally conductive, heat curable adhesive onto at least one of said mating surfaces;

aligning said mating surfaces such that said at least one component on said second side of said circuit board fits within said recessed portion of said heat sink; and

urging said mating surfaces towards one another and applying heat through said heat sink to cure said adhesive, such that said components are exposed to a lesser amount of heat than said adhesive.

2. The method of claim 1, wherein said urging step comprises applying force to at least one component on said first side of said circuit board.

3. The method of claim 1, further comprising the step of positioning spacers between said mating surfaces to maintain a minimum spacing therebetween.

4. The method of claim 1, further comprising the step of providing thermal vias in said circuit board, wherein at least a portion of said thermal vias are positioned beneath said at least one component on said first side of said circuit board to transfer heat away from said component.

5. The method of claim 1, wherein said first side of said circuit board is a high temperature side having at least one high temperature component thereon and said second side of said circuit board is a low temperature side having at least one low temperature component thereon.

6. The method of claim 5, further comprising the step of providing thermal vias in said circuit board, wherein at least a portion of said thermal vias are positioned beneath said at least one high temperature component to transfer heat away from said high temperature component.

7. A method of manufacturing a circuit assembly including a circuit board having first and second sides with at least one electronic component mounted on each of said sides, and a heat sink attached to said circuit board, said heat sink having first and second sides, said first side having a recessed portion, said second side of said circuit board and said first side of said heat sink each having corresponding mating surfaces, comprising the steps of:

dispensing a thermally conductive, heat curable adhesive onto at least one of said mating surfaces;

aligning said mating surfaces such that said at least one component on said second side of said circuit board fits within said recessed portion of said heat sink;

placing said heat sink in a tool having a platen and a heated base, said tool being operable between an open and a closed position;

placing one or more projections between said platen and said circuit board;

moving said tool from said open position to said closed position and causing said one or more projections to urge said mating surfaces together to distribute said adhesive between said mating surfaces; and

applying heat through said heat sink to cure said adhesive such that said components are exposed to a lesser amount of heat than said adhesive.

8. The method of claim 7, wherein said one or more projections urges said mating surfaces together by applying force to said at least one component on said first side of said circuit board.

9. The method of claim 7, wherein said heated base comprises a plurality of resistive heating elements for generating said heat.

10. The method of claim 7, wherein each of said projections comprises a biasing member and a plunger.

11. The method of claim 7, further comprising the step of positioning spacers between said mating surfaces to maintain a minimum spacing therebetween.

12. The method of claim 7, further comprising the step of providing thermal vias in said circuit board, wherein at least a portion of said thermal vias are positioned beneath said component on said first side of said circuit board to transfer heat away from said component.

13. The method of claim 7, wherein said first side having said circuit board is a high temperature side having at least one high temperature component thereon and said second side of said circuit board is a low temperature side having at least one low temperature component thereon.

14. The method of claim 13, further comprising the step of providing thermal vias in said circuit board, wherein at least a portion of said thermal vias are positioned beneath said at least one high temperature component to transfer heat away from said high temperature component.

15. The method of claim 7, wherein the step of placing one or more projections between said platen and said circuit board comprises providing said platen with a plurality of adjustable projections.

16. The method of claim 15, further comprising the step of adjusting the height of each of said projections so that each of said projections supplies a predetermined force to said mating surfaces when said tool is moved to said closed position.