Angle defined trench conductor for a semiconductor device

  • US 5,610,441 A
  • Filed: 05/19/1995
  • Issued: 03/11/1997
  • Est. Priority Date: 05/19/1995
  • Status: Expired due to Fees
First Claim
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1. A substrate with densely packed conductors, comprising:

  • a substrate;

    a trench in said substrate including first and second spaced apart sidewalls, said trench having a closed bottom which extends between said first and second spaced apart sidewalls and an open top;

    polysilicon positioned within said trench and contacting said first and second sidewalls, said polysilicon having a top edge which is angled to approximate a shadow line that extends from said top of said trench on said first sidewall to an intermediate point on said second sidewall; and

    a conductor positioned on said substrate adjacent said trench, said conductor being in contact with said top edge of said polysilicon adjacent said first side wall of said trench.

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