Semiconductor nonvolatile memory cell

• US 5,619,051 A
• Filed: 06/23/1995
• Issued: 04/08/1997
• Est. Priority Date: 06/27/1994
• Status: Expired due to Fees

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Endo, Nobuhiro
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US08/493,455
• Time in Patent Office: 655 Days
• Field of Search: 257/314, 257/315, 257/316, 257/317, 257/318, 257/319, 257/320, 257/321, 257/322, 257/323, 257/324, 257/325, 257/326, 257/410, 257/411
• US Class Current: 257/316
• CPC Class Codes: H01L 21/28202 in a nitrogen-containing ambient, e.g. nitride deposition, growth, oxynitridation, NH3 nitridation, N2O oxidation, thermal nitridation, RTN, plasma nitridation, RPN
• CPC Class Codes: H01L 29/513 the variation being perpendicular to the channel plane
• CPC Class Codes: H01L 29/518 the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material

Abstract

In a floating-gate type nonvolatile memory cell, the second dielectric film between the floating gate and the control gate is made very higher in relative permittivity than the first dielectric film under the floating gate such that the relation ε₂ /ε₁ ≧13 and the relation t₂ /t₁ ≧ε₂ /ε₁ hold, where εand t represent relative permittivity and film thickness, respectively and subscripts 1 and 2 represent the first and second dielectric films, respectively. Strontium titanate, barium strontium titanate or lead zirconate-titanate is suitable as the material of the second dielectric film. In the case of, e.g. barium strontium titanate film, the proportion of Sr to Ba may vary in the direction of the film thickness. The second dielectric film may be made up of two (or more) different dielectric layers. The memory cell is low in writing and erasing voltages and excellent in endurance in terms of write/erase cycles.

Claims

1. In a semiconductor nonvolatile memory cell having a first dielectric film on a semiconductor substrate, a floating gate electrode which lies on the first dielectric film, a second dielectric film which lies on the floating gate electrode and a control gate electrode which lies on the second dielectric film,

the improvement comprising said first and second dielectric films being formed such that the relations (a) and (b) hold:

space="preserve" listing-type="equation">ε

.sub.2 /ε

.sub.1 ≧

13 (a)

space="preserve" listing-type="equation">t.sub.2 /t.sub.1 ≦

ε

.sub.2 /ε

.sub.1 ( b)

where ε

₁ is the relative permittivity of the first dielectric film, ε

₂ is the relative permittivity of the second dielectric film, t₁ is the thickness of the first dielectric film and t₂ is the thickness of the second dielectric film.

2. A memory cell according to claim 1, wherein the permittivity ratio ε

₂ /ε

₁ is higher than 20.

3. A memory cell according to claim 1, wherein the control gate electrode covers the same area as the floating gate electrode.

4. A memory cell according to claim 1, wherein the second dielectric film is formed of a compound oxide selected from the group consisting of strontium titanate, barium strontium titanate and lead zirconate-titanate.

5. A memory cell according to claim 1, wherein the second dielectric film is formed of a solid solution of two kinds of metal oxides such that the proportions of the two kinds of metal oxides in the solid solution vary in the direction of the thickness of the film.

6. A memory cell according to claim 5, wherein said proportions vary continuously.

7. A memory cell according to claim 5, wherein said proportions vary stepwise.

8. A memory cell according to claim 5, wherein said two kinds of metal oxides are barium titanate and strontium titanate.

9. A memory cell according to claim 1, wherein the second dielectric film is a laminate comprising at least one layer of a dielectric material and at least one layer of another dielectric material.

10. A memory cell according to claim 9, wherein the second dielectric film comprises, a tantalum oxide layer and a strontium titanate layer.

11. A memory cell according to claim 9, wherein the second dielectric film comprises a tantalum oxide layer and a barium strontium titanate layer.

12. A memory cell according to claim 9, wherein the second dielectric film comprises a strontium titanate layer and a barium strontium titanate layer.

13. A memory cell according to claim 1, wherein the material of the first dielectric film is selected from the group consisting of silicon oxide, silicon nitride and silicon oxynitride.