Pattern recognition alignment system
DCFirst Claim
1. An exposure and alignment system comprising:
- an optical projection system disposed to expose a substrate with an exposure pattern from a reticle;
an optical alignment system disposed to form a first alignment image of a first region of said reticle defining a first key pattern therein and a superimposed image of a first portion of said substrate defining a first target pattern therein through said optical projection system;
a memory;
a pattern recognition system to recognize said first key and target patterns in said first alignment image, wherein said first key and target patterns to be recognized are arbitrary and user selectable, wherein said first key and target patterns are learned by said pattern recognition system and stored in said memory;
a computational subsystem coupled to said pattern recognition system to compute positions of said first key and target patterns and their positional difference to determine a deviation in position between said substrate and a reference position, in response to said position of said first key pattern.
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Abstract
A substrate alignment and exposure system is disclosed The alignment is performed by capturing an image of the substrate with a pattern recognition system, determining the offset from the alignment and moving the substrate relative to the reticle to be in alignment. A first optical alignment system which captures an image of a position of the substrate off of the primary axis of the exposure optics is used to perform pre-alignment. A second optical alignment system captures an image of the reticle and the substrate through the lens of the exposure optics. The pattern recognition system recognizes the alignment keys on the reticle, alignment targets on the substrate, and computes their positions and displacement from alignment. The relative alignment can be direct or inferred. Any angular and translational misalignment is calculated. The pattern recognition system then moves the substrate to be in alignment with the reticle. In the present invention, any arbitrary feature on the reticle and substrate, including device features or specialized alignment keys and targets used by other exposure systems, can be recognized by the pattern recognition system and used for alignment.
80 Citations
16 Claims
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1. An exposure and alignment system comprising:
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an optical projection system disposed to expose a substrate with an exposure pattern from a reticle; an optical alignment system disposed to form a first alignment image of a first region of said reticle defining a first key pattern therein and a superimposed image of a first portion of said substrate defining a first target pattern therein through said optical projection system; a memory; a pattern recognition system to recognize said first key and target patterns in said first alignment image, wherein said first key and target patterns to be recognized are arbitrary and user selectable, wherein said first key and target patterns are learned by said pattern recognition system and stored in said memory; a computational subsystem coupled to said pattern recognition system to compute positions of said first key and target patterns and their positional difference to determine a deviation in position between said substrate and a reference position, in response to said position of said first key pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 12)
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11. A method of aligning a substrate to a reticle comprising the steps of:
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learning first key and target patterns included on said reticle and substrate, respectively, and storing said first key and target patterns in a memory, wherein each of said first key and target patterns is arbitrary and user selectable; forming a first alignment image of a first region of said substrate; recognizing said first key and target patterns within said first alignment image computing positions of said first key and target patterns and their positional difference; determining a deviation in position between said substrate and a reference position, in response to said position of said first key pattern. - View Dependent Claims (14, 15, 16)
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13. The method as described in step 4 wherein said substrate comprises fine alignment targets, wherein said first target pattern comprises at least a portion of said fine alignment targets, and wherein said step of positioning said substrate positions said substrate angularly and translationally such that said fine alignment targets on said substrate are within a first and second field of view of first and second objectives, respectively, of a fine alignment optical assembly.
Specification