Wafer tray and ceramic blade for semiconductor processing apparatus

• US 5,636,964 A
• Filed: 05/10/1995
• Issued: 06/10/1997
• Est. Priority Date: 07/15/1993
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Kolstoe, Gary M., White, Gregory W., Faraco, W. George Jr., Somekh, Sasson, Fairbairn, Kevin
• Primary Examiner(s): Underwood, Donald W.
• Application Number:
  US08/438,670
• Time in Patent Office: 762 Days
• Field of Search: 414/222, 414/225, 414/331, 414/416, 414/217, 414/939, 414/937, 414/941, 414/786
• US Class Current: 414/806
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: Y10S 294/907 Sensor controlled device
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber
• CPC Class Codes: Y10S 414/141 includes means for gripping wafer

Abstract

A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The storage chamber pressure varies between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated enviroment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper and lower halves together defining vacuum channels and capacitive position sensors.

Claims

1. A method of transferring a substrate in a substrate processing apparatus including a processing chamber, a primary substrate storage, and a secondary substrate storage, the method comprising the steps of:

(a) providing a substrate transfer mechanism having a mechanical arm, a generally flat substrate carrying blade at the leading end of the mechanical arm, and a substrate supporting tray;

(b) engaging the undersurface of a substrate in said primary substrate storage with said blade;

(c) transferring the engaged substrate from said primary substrate storage to said secondary substrate storage by means of said substrate transfer mechanism;

(d) mounting said tray onto said blade;

(e) engaging the undersurface of a substrate located in said secondary storage with said tray mounted on said blade; and

(f) transferring the substrate, having its undersurface engaged by said tray, from said secondary storage to said chamber by means of said substrate transfer mechanism.

2. A method of transferring a substrate as recited in claim 1, further comprising the steps of:

(a) providing a first sensor comprising a part of said blade; and

(b) sensing the proximity of the substrate, with the first sensor, as the blade engages the substrate in the primary substrate storage.

3. A method of transferring a substrate as recited in claim 1, further comprising the steps of:

(a) providing a source of suction, at least a portion of which comprises a part of said blade; and

(b) applying suction to an interface between the blade and the substrate when the substrate is engaged by the blade in the primary storage, whereby the substrate is held on the blade by means of the suction as the substrate is transferred between the primary and secondary storages.

4. A method of transferring a substrate in a substrate processing apparatus including a processing chamber, a primary substrate storage, and a secondary substrate storage, the method comprising the steps of:

(a) providing a substrate transfer mechanism having a mechanical arm, a generally flat substrate carrying blade at the leading end of the mechanical arm, and a substrate supporting tray;

b) providing a first sensor and a second sensor, each comprising a part of said blade;

c) engaging a substrate in said primary substrate storage with said blade;

d) sensing the proximity of said substrate, with said first sensor, as said blade engages said substrate in said primary substrate storage;

(e) transferring the engaged substrate from said primary substrate storage to said secondary substrate storage by means of said substrate transfer mechanism;

(f) mounting said tray onto said blade;

(g) sensing the proximity of said tray, with said second sensor, as said blade engages said tray;

(h) engaging a substrate located in said secondary substrate storage with said tray and blade combination; and

(i) transferring said substrate, engaged by said tray and blade combination, from said secondary storage to the chamber by means of said substrate transfer mechanism.