Thin film semiconductor device and photoelectric conversion device using the thin film semiconductor device
First Claim
1. A thin film semiconductor device comprising at least one thin semiconductor layer which forms a heterojunction with a non-single crystal silicon layer or non-single crystal silicon-germanium layer, wherein the valence band discontinuity arising from the difference in optical energy bandgap at the heterointerface between said thin semiconductor layer and said non-single crystal silicon layer or said non-single crystal silicon-germanium layer is less than 0.3 eV, wherein said thin semiconductor layer is a non-single crystal silicon carbide layer including hydrogen atoms, said non-single crystal silicon carbide layer having a value x greater than 0.45 where said non-single crystal silicon carbide layer is described as Si1-x Cx :
- H and the number of hydrogen atoms bonded with carbon atoms in said non-single crystal silicon carbide layer is at least five times the number of hydrogen atoms bonded with silicon atoms, and wherein said thin semiconductor layer has an optical energy bandgap greater than 2.8 eV and the conduction bandgap discontinuity arising from the difference in optical energy bandgap is greater than 1.0 eV.
0 Assignments
0 Petitions
Accused Products
Abstract
A high performance thin film semiconductor device having a heterojunction such as a photoelectric conversion device is disclosed. In accordance with the present invention, the thin film semiconductor device comprises a thin semiconductor layer which forms a heterojunction with a non-single crystal silicon layer or non-single crystal silicon-germanium layer, wherein the valence band discontinuity at the heterointerface arising from the difference in optical energy bandgap is as small as 0.3 eV or less and wherein the thin semiconductor layer has an optical energy bandgap greater than 2.8 eV, so that hole transport performance may not be degraded. Such a thin semiconductor layer may be formed by using silane gas and methane gas with a flow rate ratio greater than 30 at a deposition rate less than 0.5 Å/sec.
57 Citations
24 Claims
-
1. A thin film semiconductor device comprising at least one thin semiconductor layer which forms a heterojunction with a non-single crystal silicon layer or non-single crystal silicon-germanium layer, wherein the valence band discontinuity arising from the difference in optical energy bandgap at the heterointerface between said thin semiconductor layer and said non-single crystal silicon layer or said non-single crystal silicon-germanium layer is less than 0.3 eV, wherein said thin semiconductor layer is a non-single crystal silicon carbide layer including hydrogen atoms, said non-single crystal silicon carbide layer having a value x greater than 0.45 where said non-single crystal silicon carbide layer is described as Si1-x Cx :
- H and the number of hydrogen atoms bonded with carbon atoms in said non-single crystal silicon carbide layer is at least five times the number of hydrogen atoms bonded with silicon atoms, and wherein said thin semiconductor layer has an optical energy bandgap greater than 2.8 eV and the conduction bandgap discontinuity arising from the difference in optical energy bandgap is greater than 1.0 eV.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
12. A thin film semiconductor device having a multi-layer semiconductor region and an insulating layer, comprising:
-
a plurality of non-single crystal silicon layers or a plurality of non-single crystal silicon-germanium layers; and a plurality of thin semiconductor layers which are disposed between said plurality of non-single crystal silicon layers or of non-single crystal silicon-germanium layers in such a manner that said plurality of thin semiconductor layers form heterojunctions; wherein the valence band discontinuity arising from the difference in optical energy bandgap at said heterojunction between said thin semiconductor layer and said non-single crystal silicon layer or said non-crystal silicon-germanium layer is less than 0.3 eV, wherein said thin semiconductor is a non-crystal silicon carbide layer including hydrogen atoms, said non-single crystal carbide layer having a value x greater than 0.45 where said non-single crystal silicon carbide layer is described as Si1-x Cx ;
H and the number of hydrogen atoms bonded with carbon atoms in said non-single crystal silicon carbide layer is at least five times the number of hydrogen atoms bonded with silicon atoms, and wherein said thin semiconductor layer has an optical energy bandgap greater than 2.8 eV and the conduction bandgap discontinuity arising from the difference in optical energy bandgap is greater than 1.0 eV. - View Dependent Claims (13, 14, 15)
-
-
16. An information processing device comprising:
-
a thin film semiconductor device comprising at least one thin semiconductor layer which forms a heterojunction with a non-single crystal silicon layer or non-single crystal silicon-germanium layer, wherein the valence band discontinuity arising from the difference in optical energy bandgap at the heterointerface between said thin semiconductor layer and said non-single crystal silicon layer or said non-single crystal silicon-germanium layer is less than 0.3 eV, wherein said thin semiconductor layer is a non-single crystal silicon carbide layer including hydrogen atoms, said non-single crystal silicon carbide layer having a value x greater than 0.45 where said non-single crystal silicon carbide layer is described as Si1-x Cx ;
H and the number of hydrogen atoms bonded with carbon atoms in said non-single crystal silicon carbide layer is at least five times the number of hydrogen atoms bonded with silicon atoms, and wherein said thin semiconductor layer has an optical energy bandgap greater than 2.8 eV and the conduction bandgap discontinuity arising from the difference in optical energy bandgap is greater than 1.0 eV; anda signal output device, said thin film semiconductor device being formed on said signal output device or said thin film semiconductor device being electrically connected to said signal output device, said signal output device comprising at least one of means including (i) storage means for storing an electrical signal generated by said thin film semiconductor device, (ii) scanning means for scanning said electrical signal, and (iii) read-out means for reading out said electrical signal. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
-
Specification