Land grid array socket for use with integrated circuit modules of different sizes including modules which are larger than the socket

• US 5,702,256 A
• Filed: 12/28/1995
• Issued: 12/30/1997
• Est. Priority Date: 12/28/1995
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Severn, E. Thomas
• Primary Examiner(s): Paumen, Gary F.
• Assistant Examiner(s): GOINS, CHRISTOP
• Application Number:
  US08/579,796
• Time in Patent Office: 733 Days
• Field of Search: 439/70, 439/71, 439/73, 439/525, 439/526, 439/330, 439/337
• US Class Current: 439/71
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/1061 co-operating by abutting

Abstract

A socket for coupling one of a first integrated circuit module having a first footprint and a first terminal array, or a second integrated circuit module having a second larger footprint to a printed circuit board. A socket base has a top surface for receiving one of the first and second integrated circuit modules and a bottom surface adapted to be mounted on a printed circuit board. A first array of contacts extends transversely through the base from the top surface to the bottom surface for electrically coupling the first terminal array to the printed circuit board. An alignment feature coupled to the base, is configured to align one of the first or second integrated circuit modules within the socket base such that the terminals of either the first or second integrated circuit modules engage the contact array, the second integrated circuit module extending beyond the alignment feature when aligned in the socket.

Claims

1. A socket for coupling a land grid array (LGA) module to a circuit board, the LGA module having a first set of land pads for coupling a first integrated circuit device on the LGA module to a circuit board, the socket comprising:

a non-conductive base for seating the LGA module in the socket;

a first set of contacts extending through the base for electrically coupling the socket to the circuit board; and

an alignment feature configured on the base around the first set of contacts for aligning the LGA module in the socket such that the first set of land pads is aligned with the first set of contacts, the alignment feature having an opening providing for at least one side of the LGA module to extend outside of the socket boundary.

2. The socket as set forth in claim 1 further including a second set of contacts extending through the socket base from the top surface to the bottom surface, wherein the land grid array module includes a second set of land pads, the second set of land pads aligning with the second set of contacts when the land grid array module is aligned in the socket by the alignment feature.

3. The socket as set forth in claim 1 wherein the alignment feature extends around the first set of contacts with an opening at one side.

4. The socket as set forth in claim 1 wherein the alignment feature includes key features at either side of the opening in the alignment features and wherein the land grid array module includes notches which interlock with the key features of the alignment feature to secure the land grid array module in the socket base when the land grid array module is aligned with the alignment feature.

5. The socket as set forth in claim 1 further including a socket lid coupled to the socket base, the socket lid having an open and a closed position, the socket lid retaining the land grid array module seated and aligned in the socket base when the socket lid is in a closed position.

6. The socket as set forth in claim 1 further including heat sink attachment features for attaching a heat sink to the socket base.

7. The socket as set forth in claim 1 wherein the first integrated circuit device is a microprocessor and the LGA module includes a second device, the second device being a cache memory device.

8. The socket as set forth in claim 1 wherein the printed circuit board includes one or more devices coupled to the printed circuit board and wherein the socket base has height such that the land grid array module extends above the one or more devices when the land grid array module is aligned in the socket and extends outside the socket.