Non-contact IC card and process for its production

• US 5,705,852 A
• Filed: 04/09/1996
• Issued: 01/06/1998
• Est. Priority Date: 04/13/1995
• Status: Expired due to Term

• Current Assignee: Sony Chemicals Company Limited (Sony Group Corp.)
• Original Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Inventors: Monkawa, Haruo, Fujimoto, Masahiro, Orihara, Katsuhisa, Kurita, Hideyuki
• Primary Examiner(s): Whitehead, Carl W.
• Assistant Examiner(s): Clark, S. V.
• Application Number:
  US08/629,565
• Time in Patent Office: 637 Days
• Field of Search: 257/679, 257/778, 257/782, 257/783, 257/780, 437/215, 437/228, 437/229, 437/925
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/29075 Plural core members
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/81903 by means of a layer connector
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 24/74 Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor

Abstract

In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.

Claims

1. A non-contact IC card that transfers information through an induction electromagnetic field serving as a transmission medium comprising:

a substrate having at least an IC chip and an antenna coil formed by etching;

wherein a connecting terminal of said antenna coil and a connecting bump of said IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer;

the IC chip being formed across the antenna coil;

wherein at least part of said antenna coil is decreased in width so that a distance between the connecting terminal on an inner peripheral side and the connecting terminal on an outer peripheral side of said antenna coil is substantially the same as a distance between the connecting bumps of said IC chip which are connected with the terminals.

2. The non-contact IC card according to claim 1, wherein a tuning capacitor which constitutes an resonance circuit, and a voltage smoothing capacitor are provided within the area of the IC chip.

3. The non-contact IC card according to claim 1, wherein a tuning capacitor which constitutes an resonance circuit, and/or a voltage smoothing capacitor is/are provided on the substrate separately from said IC chip, and these capacitors are formed by etching.

4. A non-contact IC card that transfers information through an induction electromagnetic field serving as a transmission medium comprising:

a substrate having at least an IC chip and an antenna coil formed by etching, wherein a connecting terminal of said antenna coil and a connecting bump of said IC chip are directly interconnected by wire bonding,

the IC chip being formed across the antenna coil,

wherein at least part of said antenna coil is decreased in width so that a distance between the connecting terminal on an inner peripheral side and the connecting terminal on an outer peripheral side of said antenna coil is substantially the same as a distance between the connecting bumps of said IC chip which are connected with the terminals.

5. The non-contact IC card according to claim 4, wherein a tuning capacitor which constitutes an resonance circuit, and a voltage smoothing capacitor are provided within the area of the IC chip.

6. The non-contact IC card according to claim 4, wherein a tuning capacitor which constitutes an resonance circuit, and/or a voltage smoothing capacitor is/are provided on the substrate separately from said IC chip, and these capacitors are formed by etching.

7. A process for producing a non-contact IC card, comprising the steps of;

forming a resist layer having at least an antenna coil pattern, on a conductive layer provided on an insulating substrate;

etching the conductive layer, using the resist layer as a mask, to form at least an antenna coil and a connecting terminal thereof;

forming an anisotropic conductive adhesive layer on the connecting terminal of the antenna coil; and

interconnecting the connecting terminal of the antenna coil and a connecting bump of an IC chip in a face-down fashion via the anisotropic conductive adhesive layer.