Method of wire bonding an integrated circuit to an ultraflexible substrate

• US 5,708,419 A
• Filed: 07/22/1996
• Issued: 01/13/1998
• Est. Priority Date: 07/22/1996
• Status: Expired due to Term

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated), Mitsubishi Materials Corporation
• Original Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Inventors: Holloway, Michael, Isaacson, Mark R., Piccoli, Anthony F.
• Primary Examiner(s): SWANN III, GLEN R
• Application Number:
  US08/681,195
• Time in Patent Office: 540 Days
• Field of Search: 340/572, 340/825.34, 340/825.54, 29/841, 29/832, 29/850, 29/829
• US Class Current: 340/572.5
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G06K 19/0726 the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85909 Post-treatment of the connector or wire bonding area
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/80 Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49162 : by using wire as conductive path

Abstract

A method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate. A flexible dielectric substrate has an IC attachment area and at least one resonant circuit formed thereon. The resonant circuit is formed with a first conductive pattern disposed on a first principal surface of the flexible substrate and a second conductive pattern disposed on a second, opposite principle surface of the flexible substrate. The first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, with the inductor also functioning as an antenna. The IC attachment area of the flexible substrate is cleaned and the flexible substrate is secured in a fixed position in a plenum to prevent substantial movement thereof. The IC is secured to the IC attachment area of the flexible substrate to minimize movement of the IC relative to the flexible substrate. Wire bonding of the IC to at least one electrical conductor of the resonant circuit is performed to electrically connect the IC to the at least one electrical conductor. A protective covering is applied over the IC and the wire bond to protect the wire bond from being damaged by external forces.

Claims

1. A method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate comprising the steps of:

(a) providing a flexible dielectric substrate having an IC attachment area located on one of a first principal surface and a second, opposite principal surface of the substrate and at least one resonant circuit comprising a first conductive pattern disposed on the first principal surface and a second conductive pattern disposed on the second principal surface, wherein the first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, wherein the inductor functions as an antenna;

(b) cleaning an IC bond attach area of the substrate, the IC bond attach area comprising an area of the substrate and the resonant circuit proximate to and including the IC attachment area;

(c) securing the flexible substrate in a fixed position to prevent substantial movement of the substrate;

(d) securing the IC to the IC attachment area of the flexible substrate to minimize movement of the IC relative to the flexible substrate;

(e) wire bonding the IC to the resonant circuit, thereby electrically connecting the IC to the resonant circuit with at least one wire bond; and

(f) applying a protective covering over the at least one wire bond to protect the at least one wire bond from being damaged by external forces.

2. The method of claim 1 wherein the flexible substrate comprises a polyethylene layer.

3. The method of claim 2 wherein the conductive patterns comprise aluminum.

4. The method of claim 1 wherein the IC is secured to the flexible substrate in step (d) with an epoxy and wherein the epoxy spreads beyond a perimeter of the IC, thereby forming a stiff region on the substrate proximate the IC.

5. The method of claim 4 further comprising the step of curing the epoxy prior to wire bonding the IC to the substrate in step (e).

6. The method of claim 5 wherein the epoxy is cured with ultraviolet light.

7. The method of claim 1 wherein the IC bond attach area is cleaned in step (b) with acetone.

8. The method of claim 7 further comprising the step of abrasively cleaning at least a portion of the resonant circuit proximate to the IC attachment area to remove oxidation therefrom prior to performing the wire bonding step (e).

9. The method of claim 1 wherein the protective covering comprises an encapsulant.

10. The method of claim 9 further comprising after step (f), the step of curing the encapsulant with ultraviolet light.

11. The method of claim 1 further comprising the step of positioning the IC in a predetermined orientation with respect to the flexible substrate.

12. The method of claim 1 wherein the IC is wire bonded to the resonant circuit by ultrasonic welding, wherein securing the IC to the IC attachment area and securely holding the substrate in a fixed position prevents substantial movement of both the substrate and the IC, thereby preventing excessive energy dissipation during the welding process.

13. The method of claim 1 wherein the substrate is securely held in the fixed position in step (c) in a plenum utilizing vacuum pressure and an adhesive.

14. The method of claim 1 further comprising after step (f), the step of adhesively attaching the flexible substrate to a polymeric housing having a recess for accommodating the IC.

15. The method of claim 1 further comprising after step (f), the step of programming the IC with predetermined digitally encoded information.

16. The method of claim 1 wherein the IC attachment area comprises a portion of one of the first and second conductive patterns wherein the one conductive pattern provides a stiff region to which the IC is secured.

17. A radio frequency identification (RFID) tag for use with a communication system having means for detecting the presence of an RFID tag within a surveilled area utilizing electromagnetic energy at a frequency within a predetermined frequency range and means for receiving digitally encoded information transmitted from the RFID tag, the RFID tag comprising:

a flexible dielectric substrate;

at least one resonant circuit comprising a first conductive pattern disposed on a first principal surface of the flexible substrate and a second conductive pattern disposed on a second, opposite principle surface of the flexible substrate, wherein the first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, wherein the inductor functions as an antenna;

an IC attachment area on one of the first and second principal surfaces of the substrate;

an integrated circuit (IC) attached to the IC attachment area and electrically connected to the resonant circuit, the IC storing digitally encoded information, wherein detection by the antenna of a signal at a predetermined frequency causes the antenna to provide power to the IC such that the digitally encoded information is output therefrom and transmitted by the antenna at a predetermined frequency range; and

an encapsulant covering the IC and the electrical connections between the IC and the resonant circuit.

18. The security tag of claim 17 wherein the IC attachment area comprises a shoulder of the inductor formed by one of the first and second conductive patterns.

19. The security tag of claim 17 wherein the IC is adhesively attached to the IC attachment area.

20. The security tag of claim 17 wherein the first and second conductive patterns comprise etched aluminum.

21. The security tag of claim 17 further comprising a polymeric housing covering the first conductive pattern and the IC, wherein the housing includes a recess for receiving the IC therein.