H-field electromagnetic heating system for fusion bonding

  • US 5,710,413 A
  • Filed: 03/29/1995
  • Issued: 01/20/1998
  • Est. Priority Date: 03/29/1995
  • Status: Expired due to Fees
  • ×
    • Pin Icon | RPX Insight
    • Pin
First Claim
Patent Images

1. A system for fusion bonding via electromagnetic heating in the H-field, comprising:

  • a composite bonding material having a bonding matrix and a plurality of susceptors, said susceptors being magnetically reactive at a frequency of from above 50 MHz to less than or equal to about 1000MH;

    applicator means for applying radiant electromagnetic energy to said composite bonding material at a frequency of from above 50 MHz to less than or equal to about 1000MHz, such that said susceptors may be heated sufficiently to melt a portion of said bonding matrix;

    said applicator means including a plurality of wires, electrically insulated from one another, each forming a coil with a common axis, each of said wires being electrically connected in parallel, wherein several of said plurality of wires are stacked to form multiple layers of said coils, such that the effective resistance of said applicator is reduced and the current-carrying capacity is increased; and

    a plurality of capacitors, each connected in series with a respective one of said wire coils, such that current in said coils is approximately uniform for coil circumferences which are greater than 0.1 of the wavelength of said radiant electromagnetic energy.

View all claims

    Thank you for your feedback