Ultrashort pulse high repetition rate laser system for biological tissue processing

  • US 5,720,894 A
  • Filed: 01/11/1996
  • Issued: 02/24/1998
  • Est. Priority Date: 01/11/1996
  • Status: Expired due to Term
First Claim
Patent Images

1. A method for selective material removal processing comprising:

  • providing a pulsed laser;

    operating said laser so as to produce a pulsed output beam, the beam comprising individual pulses each having a pulse duration in the range of from about 1 femtosecond to about 100 picoseconds;

    directing said pulsed output beam onto a target material from which removal is desired, wherein each pulse interacts with a thin layer portion of said material so as to form a plasma;

    allowing said formed plasma to decay, such that said material portion is removed; and

    repeating said plasma formation step at a pulse repetition rate greater than 10 pulses per second until a sufficient depth of material has been removed with substantially no transfer of thermal or mechanical energy into the remaining material and substantially no collateral damage thereto.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×