Ceramic chip fuses with multiple current carrying elements and a method for making the same

  • US 5,726,621 A
  • Filed: 08/11/1995
  • Issued: 03/10/1998
  • Est. Priority Date: 09/12/1994
  • Status: Expired due to Term
First Claim
Patent Images

1. A chip fuse, comprising:

  • a plurality of substrate layers of ceramic material each having an upper surface, said substrate layers being arranged in a stack having at least an uppermost and lowermost substrate layer;

    a fuse element of electrically conductive material disposed on the upper surface of two or more of said substrate layers, each of said fuse elements comprising a pad of electrically conductive material disposed at each of a first and a second end portion of said first substrate, and at least one fusible element electrically connecting said pads;

    a cover of ceramic material covering an upper surface of the uppermost substrate layer, wherein said substrate layers and cover form a laminate structure having first and second end portions; and

    means for electrically interconnecting said fuse elements of the plurality of substrate layers, whereinsaid means for electrically interconnecting the fuse elements comprises a plurality of conductors each disposed in one of a plurality of holes extending through the substrate layers in predetermined locations to electrically connect the fuse elements of adjacent substrate layers,said means for electrically connecting at least an uppermost fuse element to the end termination at the first end portion comprises a conductor disposed in a hole extending from a pad on the uppermost substrate layer through the uppermost substrate layer and intervening substrate layers to the end termination; and

    said means for electrically connecting said lowermost fuse element to the end termination at the second end portion comprises a conductor disposed in a hole extending from a pad on said lowermost substrate layer through the lowermost substrate layer to the end termination at the second portion.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×