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Method and apparatus for contour multi-level embossing with perforation bonding in selected spaced locations

  • US 5,727,458 A
  • Filed: 03/20/1996
  • Issued: 03/17/1998
  • Est. Priority Date: 03/20/1996
  • Status: Expired due to Fees
First Claim
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1. An apparatus for providing perforation bonding and embossing of multiple plies of web material, comprising:

  • at least two backup rolls; and

    at least two embossing rolls, each of said embossing rolls positioned adjacent a respective one of said backup rolls so as to create an interference between said rolls during rotation to emboss said web material which is fed therethrough, each of said embossing rolls further positioned adjacent to one another so as to create an interference between said embossing rolls for perforation bonding said web material which is fed therethrough in a nip region, said embossing rolls including;

    a plurality of embossing elements for forming an embossed pattern in the web material, said embossing elements having at least two different heights arranged in an embossing pattern for embossing said web material; and

    a plurality of perforation elements, said perforation elements being the highest element on said embossing rolls for perforation bonding and embossing said web material;

    wherein said perforation elements of at least two of said embossing rolls interfere with one another in said nip region such that the plies of the web material are perforation bonded to one another.

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