Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation

• US 5,742,026 A
• Filed: 06/26/1995
• Issued: 04/21/1998
• Est. Priority Date: 06/26/1995
• Status: Expired due to Fees

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Dickinson, James E. Jr., Wheaton, Bryan R.
• Primary Examiner(s): Evans, Geoffrey S.
• Application Number:
  US08/494,911
• Time in Patent Office: 1,030 Days
• Field of Search: 219/121.65, 219/121.66, 219/121.69, 219/121.85, 219/121.68, 264/400, 264/409, 65/33.2, 65/61, 65/104, 65/33.1, 501/10, 437/173, 73/105, 250/306, 428/64.1
• US Class Current: 219/121.69
• CPC Class Codes: B23K 2103/52 Ceramics
• CPC Class Codes: B23K 26/3576 Diminishing rugosity, e.g. grinding; Polishing; Smoothing
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: C03B 29/00 Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins

Abstract

A method for polishing glass, ceramic, and glass-ceramic surfaces. The method includes exposing the surface to ultraviolet laser radiation under conditions effective to smooth the surface. Methods for polishing glass-ceramic surfaces containing spinel crystals using 193-351 nm radiation of a rare gas halide excimer laser operating at about 150 to about 400 mJ/cm² are disclosed. Using the methods of the present invention, surfaces having an R_a of about 4 to about 2 Å are produced.

Claims

1. A process for polishing an entire surface on a glass, or a glass-ceramic article to smooth that surface, said process consisting essentially of:

exposing the surface to ultraviolet laser radiation under conditions effective to

remove material from the entire surface to improve the smoothness of the surface.

2. A process according to claim 1, wherein the ultraviolet laser radiation has a wavelength from about 193 nm to about 351 nm.

3. A process according to claim 1, wherein the ultraviolet laser radiation is excimer laser radiation.

4. A process according to claim 3, wherein the excimer laser radiation is produced by a rare gas halide excimer laser.

5. A process according to claim 1, wherein the surface is exposed to ultraviolet laser radiation under conditions such that the energy density of the radiation delivered by each pulse is greater than the ablation threshold of the material, and material is removed to a uniform depth over the exposed surface of the article.

6. A process according to claim 1, wherein the excimer laser operates at a power from about 150 to about 400 mJ/cm².

7. A process according to claim 1, wherein said exposing is carried out by pulsing the ultraviolet laser radiation.

8. A process according to claim 7, wherein said pulsing is at a frequency from about 5 to about 1000 Hz.

9. A process according to claim 1 wherein a glass-ceramic surface is polished by said exposing.

10. A process according to claim 9, wherein a glass-ceramic surface, comprising spinel-type crystals dispersed in a glass matrix, is polished by said exposing.

11. A process according to claim 10, wherein the glass-ceramic has a Knoop hardness of from about 500 to about 1500.

12. A process according to claim 1, wherein the surface has an R_a after said exposing of about 4 to about 2 Å

.

13. A process according to claim 1 wherein the surface is exposed to ultraviolet laser radiation having a wavelength from about 193 nm to about 351 nm, produced by a rare gas halide excimer laser operating at a power from about 150 to about 400 mJ/cm² and selected from the group consisting of ArF, KrF, XeF, and XeCl excimer lasers, under conditions effective to smooth the surface.

14. A process for polishing an entire surface on a glass, or a glass-ceramic article to smooth that surface, said process consisting essentially of:

a first step of smoothing the surface; and

a second step of exposing the surface to ultraviolet laser radiation under conditions effective to remove material from the entire surface to improve the smoothness of the surface.

15. A process according to claim 14, wherein said first step of smoothing is effected by treating the surface with an abrasive prior to said exposing.

16. A process according to claim 14, wherein the surface has an R_a of 200 to about 10 Å

, as measured by atomic force microscopy prior to said exposing.

17. A process according to claim 14 wherein the surface is smoothed to an R_a of about 200 to about 10 Å

, as measured by atomic force microscopy, by treating the surface with an abrasive, and then exposing the surface to ultraviolet laser radiation under conditions effective to smooth the surface to an R_a of about 4 to about 2 Å

, as measured by atomic force microscopy.